Method for manufacturing metal-based circuit board by employing laser cutting method
A metal-based circuit board and laser cutting technology, applied in the field of circuit board manufacturing, can solve the problem of inability to achieve independent insulation of copper bosses, and achieve the effect of satisfying heat dissipation, high heat dissipation, and realizing multi-functional product design.
Active Publication Date: 2019-08-09
KINWONG ELECTRONICS TECH LONGCHUAN
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Problems solved by technology
[0003] It can be seen that the existing boss plate has the problem that the copper boss and the copper base are integrated, that is, all the copper bosses are connected to each other, and the independent insulation of the copper bosses cannot be achieved.
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[0049] The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention, and similar component numbers in the drawings represent similar components. Apparently, the embodiments described below are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.
[0050] It should be understood that when used in this specification and the appended claims, the terms "comprising" and "comprises" indicate the presence of described features, integers, steps, operations, elements and / or components, but do not exclude one or Presence or addition of multiple other features, integers, steps, operations, elements, components and / or col...
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The embodiment of the invention discloses a method for manufacturing a metal-based circuit board by employing a laser cutting method, and relates to the technical field of circuit board manufacturing.The technical scheme is that a metal-based circuit board is taken as a research object (comprising a metal-based single-sided board and a metal-based single-sided multi-layer board), a copper substrate is subjected to laser cutting and resin filling the cut gaps through vacuum screen printing to manufacture areas which are independent and insulated from each other, then copper bosses are manufactured on the areas, the copper bosses are subjected to browning and then is pressed with a windowing RCC (remote control computer) to form a copper-based single-sided board, and then the circuit boardis manufactured according to a normal flow. After the design is electroplated, the copper bosses are connected and conducted again, and the electroplated copper is etched away when the outer layer needs to be etched, so that the copper bosses are insulated independently, and finally, the micro-space, high-heat-dissipation and multi-network design is achieved.
Description
technical field [0001] The invention relates to the technical field of circuit board manufacturing, in particular to a method for manufacturing metal-based circuit boards by laser cutting. Background technique [0002] Metal-based printed circuit boards are often used in high-power, high-heat dissipation products because of their good heat dissipation capabilities (the thermal conductivity of metal copper is 400W / m.k). Generally, there are two designs for high heat dissipation metal substrates: 1. Copper boss, the height of the copper boss is consistent with the line surface, the components are mounted on the copper boss to dissipate heat, and all copper bosses are connected to each other; The concave cup is lower than the dielectric layer, and the position of the concave cup is silk-screened with solder paste, and the components are mounted on the position of the concave cup, and the solder paste is connected to the concave cup to dissipate heat, and all the concave cups ar...
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IPC IPC(8): H05K3/00H05K3/06
CPCH05K3/0044H05K3/0047H05K3/06H05K2203/107
Inventor 刘玮王远罗奇张飞龙
Owner KINWONG ELECTRONICS TECH LONGCHUAN