Folding positioning fixture assembly for plastic-encapsulated diodes

Abstract

The invention discloses a plastic-sealed diode folding positioning fixture assembly, which comprises a mounting base plate, a folding shaft, a fixed piece, a scale bar, a buffer pad, a positioning seat, an adjustment head, a movable clip and a clamping plate. The beneficial effects of the present invention are: the folding shaft is rotationally connected with the equal part of the installation base plate through the action of the fixing piece, which reduces the occupied space of the device and is convenient to carry; the bottom surface of the scale bar is bonded to the installation base plate with strong glue to ensure The precise clamping of the diode reduces the error of human judgment. The top surface of the buffer pad and the mounting base plate are fixed to each other through the card slot to prevent the device from being damaged due to excessive collision during folding. The bottom of the positioning seat is slidingly connected to the mounting base plate , provide the position change measures of the fixture, improve the use range of the device, the adjustment head and the positioning seat are interspersed, and the angle of the splint can be adjusted reasonably according to the thickness of the clamped diode to ensure the precision of the device.

Description

technical field [0001] The invention relates to a clamp assembly, in particular to a plastic-encapsulated diode folding positioning clamp assembly, which belongs to the technical field of clamps. Background technique [0002] At present, the common problem in the process of hot-dip tinning of plastic-encapsulated diodes is that the structure of the fixture used to clamp and fix the plastic-encapsulated diodes is too complicated and inconvenient to assemble and disassemble, which greatly slows down the replacement speed of plastic-encapsulated diodes and leads to low production efficiency. Although a commonly used magnetic clamp is very convenient and practical for the assembly and disassembly of plastic diodes with iron electrodes, it cannot be applied to plastic diodes with copper electrodes, which has relatively large limitations. Therefore, a folding type plastic diode is required. Position the fixture assembly. [0003] The structure of the existing folding positioning ...

AI Technical Summary

Problems solved by technology

[0002] At present, the common problem in the process of hot-dip tinning of plastic-encapsulated diodes is that the structure of the fixture used to clamp and fix the plastic-encapsulated diodes is too complicated, which is inconvenient to assemble and disassemble, which greatly slows down the replacement speed of plastic-encapsulated diodes, resulting in low production efficiency.

Although a commonly used magnetic clamp is very convenient and practical for the assembly and disassembly of plastic diodes with iron electrodes, it cannot be applied to plastic diodes with copper electrodes, which has relatively large limitations. Therefore, a folding type plastic diode is required. Positioning Fixture Components

[0003] The structure of the existing folding positioning fixture assembly for plastic-encapsulated diodes is relatively simple, which cannot meet the complex use environment. First, there is no folding measure, and the device takes up a large space, which is inconvenient to carry. Second, there is no measuring device, which requires human judgment. The error is relatively large. Third, there is no buffer device, and the device is prone to excessive collision during folding, resulting in incomplete damage. Fourth, the fixture cannot be positioned and adjusted, and the use range of the device is small. Fifth, there is no tightness adjustment device. The precision of the device is low

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