Method for manufacturing semiconductor structure

Abstract

A method of making a semiconductor device that includes forming a dielectric stack over a substrate and patterning a contact region in the dielectric stack, the contact region having side portions anda bottom portion that exposes the substrate. The method also includes forming a dielectric barrier layer in the contact region to cover the side portions and forming a conductive blocking layer to cover the dielectric barrier layer, the dielectric stack, and the bottom portion of the contact region. The method can include forming a conductive layer over the conductive blocking layer and forming aconductive barrier layer over the conductive layer. The method can further include forming a silicide region in the substrate beneath the conductive layer.

Description

technical field [0001] The present disclosure relates to a semiconductor technology, in particular to a semiconductor contact plug and its forming method. Background technique [0002] Semiconductor devices are widely used in various electronic devices such as smartphones, notebook computers, digital cameras, and others. In general, a typical semiconductor device includes a substrate with active devices such as transistors, capacitors, inductors, and other components. These active components are initially isolated from each other, and then interconnect structures are formed above the active devices to create functional circuits. Such interconnect structures may include lateral interconnects, such as metal lines (wirings), and vertical interconnects, such as conductive vias or contact plugs. [0003] Demand continues to increase for smaller and faster semiconductor devices, which can simultaneously support more and more increasingly complex and advanced functions. This min...

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Problems solved by technology

However, such miniaturization also increases the complexity of the semiconductor device process and manufacturing

As the dimensions of semiconductor devices shrink to sub-micron (sub-micron) dimensions in advanced technology nodes (nodes), reducing contact plug resistance while reducing contact plug size becomes increasingly challenging

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