Multi-layer PCB structure three-dimensional magnetic field coil

A three-dimensional magnetic field and PCB board technology, which is applied in the direction of coils, measuring magnetic variables, measuring geometric arrangement of magnetic sensing elements, etc., can solve problems such as coil test data deviation, PCB wiring cannot cross, unfavorable magnetic field measurement differences, etc., to eliminate coupling interference effect

Active Publication Date: 2021-11-23
NAVAL UNIV OF ENG PLA
View PDF13 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Due to the difference in the process of winding coils, it is difficult to ensure the consistency of different measurement coils, which is not conducive to comparing the differences in magnetic field measurements at different spatial positions
The manufacturing process consistency of the printed circuit board PCB coil is good, but the PCB wiring cannot cross, and it is difficult for conventional PCB coils to avoid magnetic field coupling interference in different measurement directions
like figure 1 The double-layer PCB coil, the solid line is the top PCB wiring, and the dotted line is the bottom PCB wiring. It is designed for the measurement of the Z-direction magnetic field, and the coil is located in the XY plane; but there is an induction area for the Y-direction magnetic field between the top layer and the bottom PCB. , so the measured value will contain the coupling interference of the magnetic field in the Y direction; especially, when the magnetic field in the Z direction is small, the coupling interference of the strong magnetic field in the Y direction will make figure 1 The coil test data has a large deviation

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Multi-layer PCB structure three-dimensional magnetic field coil
  • Multi-layer PCB structure three-dimensional magnetic field coil
  • Multi-layer PCB structure three-dimensional magnetic field coil

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0017] The present invention will be further described in detail below in conjunction with the accompanying drawings and specific embodiments to facilitate a clear understanding of the present invention, but they do not limit the present invention.

[0018] The structure of the three-dimensional magnetic field coil of the multi-layer PCB structure of the present invention is as follows: Figure 2a-2f shown. In the figure, the dots are via holes, and the solid lines are PCB wiring; each layer of PCB is located on the XY plane, the X direction is to the right, the Y direction is upward, and the grid spacing of the dotted lines is 1mm; there are six layers of PCB in the Z direction, and the spacing between each layer of PCB 1mm. The specific embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings, which are meant to explain rather than limit the present invention.

[0019] The x-direction measurement coil uses mid-1, ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention provides a three-dimensional magnetic field coil with a multi-layer PCB structure, which is characterized in that: it includes at least three layers of PCB boards; the multi-layer PCB constitutes three mutually orthogonal measuring coils, and the centers of the three coils overlap, and the same spatial position can be measured. The three-dimensional magnetic field is accurately measured; the X-direction measuring coil and the Y-direction coil measuring coil use the PCB board wiring of the top layer, the bottom layer, and the middle layer respectively. The combined area of ​​the coil to the YZ direction magnetic field and the XZ direction magnetic field; the Z direction measurement coil uses the PCB board wiring in the middle layer to form the coil body, and eliminates the measurement coil to the XY direction magnetic field through the connection sequence of the PCB boards of each layer and the position of the via hole the coupling area.

Description

technical field [0001] The invention relates to the field of magnetic field measurement. Specifically, the invention relates to a three-dimensional magnetic field coil with a multilayer PCB structure, which is especially suitable for testing occasions with strong magnetic field and large rate of change, and can be used for three-dimensional space magnetic field distribution measurement of pulsed large current systems. Background technique [0002] Magnetic field measurement often uses Hall elements, magnetoresistive elements, fluxgates or coils. Hall elements, magnetoresistive elements, and fluxgates are only suitable for low-intensity magnetic field measurements, and coils can be used to measure magnetic fields of different strengths. To obtain the three-dimensional characteristics of the high-intensity magnetic field, three mutually orthogonal measuring coils can be used; to distinguish the difference in the magnetic field at different spatial positions, the measuring coil...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Patents(China)
IPC IPC(8): H01F5/00G01R33/00G01R33/10
CPCG01R33/0005G01R33/10H01F5/003
Inventor 赵治华程龙李建轩张向明李文禄孟进张磊
Owner NAVAL UNIV OF ENG PLA
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products