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Camera module, filtering assembly and manufacturing method thereof, and electronic device

A manufacturing method and technology for camera modules, which are applied in TV, electrical components, image communication, etc., can solve the problems of increasing specifications and limited available space for camera modules.

Active Publication Date: 2019-10-11
NINGBO SUNNY OPOTECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

With the development of various electronic products and smart devices, camera modules are increasingly developing in the direction of high performance and thinness. However, in the face of various high-performance development requirements such as high pixels and high imaging quality, the circuits in the There are more and more electronic components, the area of ​​the chip is getting larger and larger, and the passive components such as driving resistors and capacitors are increasing accordingly, which makes the specifications of the electronic devices larger and larger. On the premise of ensuring that the camera module is light and thin The available space in the camera module is limited, so from the above point of view, the traditional assembly method of the bracket 4P and the filter element 3P is also a great limitation to the development of the camera module to a certain extent.

Method used

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  • Camera module, filtering assembly and manufacturing method thereof, and electronic device
  • Camera module, filtering assembly and manufacturing method thereof, and electronic device
  • Camera module, filtering assembly and manufacturing method thereof, and electronic device

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Embodiment Construction

[0150] The following description serves to disclose the present invention to enable those skilled in the art to carry out the present invention. The preferred embodiments described below are only examples, and those skilled in the art can devise other obvious variations. The basic principles of the present invention defined in the following description can be applied to other embodiments, variations, improvements, equivalents and other technical solutions without departing from the spirit and scope of the present invention.

[0151] Those skilled in the art should understand that in the disclosure of the present invention, the terms "vertical", "transverse", "upper", "lower", "front", "rear", "left", "right", " The orientation or positional relationship indicated by "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings, which are only for the convenience of describing the present invention...

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Abstract

The invention provides a camera module, a light filtering assembly and a manufacturing method thereof, and an electronic device, the light filtering assembly comprises a light filtering element and asupport, the support is integrally formed and combined on the peripheral side of the light filtering element, and the light filtering assembly provides an optical path for light to pass through.

Description

technical field [0001] The invention relates to the field of optical imaging, in particular to a camera module, its filter assembly, manufacturing method and electronic equipment. Background technique [0002] The structure of the camera module is assembled from components such as a circuit board, a bracket, a photosensitive chip, a filter element, and a lens. [0003] In the traditional camera module assembly and manufacturing process, the filter element and the bracket of the camera module are usually installed by means of glue attachment. [0004] Such as figure 1 Shown is a schematic diagram of a camera module manufactured in a traditional way. The camera module includes a lens 1P, a driver 2P, a filter element 3P, a bracket 4P, a circuit board 5P, a photosensitive chip 6P and an electronic device 7P. In the manufacturing process, the photosensitive chip 6P is mounted on the circuit board 5P, then the electronic device 7P is mounted on the circuit board 5P, and then t...

Claims

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Application Information

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IPC IPC(8): H04N5/225
CPCH04N23/54H04N23/55
Inventor 赵波杰曾俊杰方银丽胡国权
Owner NINGBO SUNNY OPOTECH CO LTD
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