Waterproof mildew-resistant adhesive for food packaging and preparation method thereof
A waterproof and mildew proof, food packaging technology, applied in the direction of adhesive types, adhesives, epoxy resin glue, etc., can solve the problems of hygienic safety hazards, damage to food storage, adhesive stickiness and easy adhesion of dust, bacteria and mold, etc. To achieve the effect of not easily adhering to dust and increasing antibacterial properties
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Embodiment 1
[0040] A waterproof and mildew-proof adhesive for food packaging, comprising the following raw materials in parts by weight: 120 parts of modified epoxy resin, 8 parts of curing agent, and 35 parts of deionized water;
[0041] Described curing agent is maleic anhydride;
[0042] The preparation method of the waterproof and mildew-proof adhesive is as follows: add the modified epoxy resin and curing agent into the reaction kettle, raise the temperature to 110°C while stirring, and carry out the curing reaction for 4 hours after stirring, and add deionized water for mixing after the reaction is completed. Dilute evenly to obtain a waterproof and mildew-proof adhesive.
Embodiment 2
[0044] A waterproof and mildew-proof adhesive for food packaging, comprising the following raw materials in parts by weight: 130 parts of modified epoxy resin, 10 parts of curing agent, and 45 parts of deionized water;
[0045] Described curing agent is maleic anhydride;
[0046] The preparation method of the waterproof and mildew-proof adhesive is as follows: add the modified epoxy resin and curing agent into the reaction kettle, raise the temperature to 120°C while stirring, and carry out the curing reaction for 5 hours while stirring, and add deionized water for mixing after the reaction is completed. Dilute evenly to obtain a waterproof and mildew-proof adhesive.
Embodiment 3
[0048] A waterproof and mildew-proof adhesive for food packaging, comprising the following raw materials in parts by weight: 122 parts of modified epoxy resin, 7 parts of curing agent, and 35 parts of deionized water;
[0049] Described curing agent is maleic anhydride;
[0050] The preparation method of the waterproof and mildew-proof adhesive is as follows: add the modified epoxy resin and curing agent into the reaction kettle, raise the temperature to 114°C while stirring, and carry out the curing reaction for 2 hours while stirring, and add deionized water for mixing after the reaction is completed. Dilute evenly to obtain a waterproof and mildew-proof adhesive.
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