Microelectronic modules including thermal extension levels and methods for the fabrication thereof

Abstract

High thermal performance microelectronic modules containing thermal extension levels are provided, as are methods for fabricating such microelectronic modules. In various embodiments, the microelectronic module includes a module substrate having a substrate frontside and a substrate backside. At least one a microelectronic device, such as a semiconductor die bearing radio frequency circuitry, is mounted to the substrate frontside. A substrate-embedded heat spreader, which is thermally coupled to the microelectronic device, is at least partially contained within the module substrate, and extends to the substrate backside. A thermal extension level is located adjacent the substrate backside and extends away from the substrate backside to terminate at a module mount plane. The thermal extension level contains a heat spreader extension, which is bonded to and in thermal communication with the substrate-embedded heat spreader.

Description

technical field [0001] Embodiments of the present disclosure relate generally to microelectronics, and more particularly, to high thermal performance microelectronic modules including thermally extended layers and methods for fabricating such microelectronic modules. Background technique [0002] High power microelectronic modules, such as modules containing RF semiconductor die and other circuitry, are often prone to excessive heat generation during operation of the module. In the absence of a thermal solution for adequately dissipating heat from the module, elevated localized temperatures or "hot spots" may develop within the microelectronic module and may degrade module performance. Existing thermal solutions implemented by manufacturers typically rely on somehow increasing the metal content within the module substrate; for example, by forming strip vias within the body of the module substrate or by A prefabricated metal body, such as copper coins or copper blocks, is in...

AI Technical Summary

Problems solved by technology

In the absence of a thermal solution to adequately dissipate heat from the module, elevated localized temperatures or "hot spots" may develop within the microelectronic module and may degrade module performance

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