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A component and sealing resin technology, applied in the direction of semiconductor devices, circuits, electrical components, etc., to achieve the effect of stable operation

Active Publication Date: 2021-05-14
MURATA MFG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] However, in the above-mentioned circuit module 100, the third shielding portion 143 is provided in the groove portion 131 of the sealing layer 130, for example, unnecessary electromagnetic waves emitted from the electronic components 120 remain in the circuit module 100, and other electronic components 120 are received by Possibility of not being able to operate stably due to the influence of unnecessary electromagnetic waves

Method used

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Experimental program
Comparison scheme
Effect test

no. 1 approach ＞

[0033] refer to figure 1 The module 1 according to the first embodiment of the present invention will be described. also, figure 1 (a) is a plan view of the module 1 according to the first embodiment, figure 1 (b) is figure 1 A-A sectional view of (a).

[0034] The module 1 according to the first embodiment is mounted on, for example, a motherboard of an electronic device or the like. The module 1 has a substrate 2, a plurality of components including a first member 3 and a second member 4 mounted on one main surface 2a of the substrate 2, and a sealing resin for sealing the components including the first member 3 and the second member 4, etc. Layer 5, and shielding layer 6 covering part of the surface of sealing resin layer 5 and side surface 2c of substrate 2.

[0035] The substrate 2 is formed of, for example, low temperature co-fired ceramics, glass epoxy resin, or the like. A plurality of pad electrodes 7 are formed on one main surface 2a of the substrate 2, a p...

Deformed example 1

[0052] refer to figure 2 A module 1A according to Modification 1 of the first embodiment of the present invention will be described. also, figure 2 It is a plan view of the module 1A according to Modification 1 of the first embodiment.

[0053] The module 1A according to Modification 1 of the first embodiment and its use figure 1 The differences of the modules 1 related to the first embodiment described are as follows: figure 2 As shown, two points of the sealing resin layer 5A are provided with recesses 15, 15A. In addition, the same code|symbol is attached|subjected to the same structure as the module 1 which concerns on 1st Embodiment, and the description is abbreviate|omitted.

[0054] In the sealing resin layer 5A, when viewed from a plane perpendicular to the direction perpendicular to the one main surface 2a, between the first member 3 and the second member 4, from the surface of the sealing resin layer 5A that faces the one main surface 2a On the opposite side...

no. 2 approach ＞

[0058] refer to image 3 Module 1B according to the second embodiment of the present invention will be described. also, image 3 It is a cross-sectional view of the module 1B according to the second embodiment.

[0059] Module 1B related to the second embodiment and use figure 1 The differences of the modules 1 related to the first embodiment described are as follows: image 3 As shown, in the encapsulating resin layer 5B, when viewed from a plan view from a direction perpendicular to the one main surface 2a, a recess 15B is provided in a region overlapping with the pad electrode 7B formed on the one main surface 2a of the substrate 2, so that The point where the pad electrode 7B is exposed from the sealing resin layer 5B. In addition, the same code|symbol is attached|subjected to the same structure as the module 1 which concerns on 1st Embodiment, and the description is abbreviate|omitted.

[0060] In the sealing resin layer 5B, the surface (hereinafter referred to as "...

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Abstract

The present invention provides a module in which components are less likely to be affected by unnecessary electromagnetic waves generated from other components and can operate stably. The module (1) includes: a substrate (2); a first component (3) and a second component (4), mounted on one main surface (2a) of the substrate (2); a sealing resin layer (5), sealing the first component (3) and the second part (4); and the shielding layer (6), which covers a part of the sealing resin layer (5), when viewed from above from a direction perpendicular to one main surface (2a), in the first part ( 3) Between the second member (4), a depression (15) is formed on the sealing resin layer (5) from the surface including the upper surface (5a) of the sealing resin layer (5) toward one main surface (2a), shielding The layer (6) is not provided in the recess (15) of the sealing resin layer (5).

Description

technical field [0001] The present invention relates to a module having a structure that suppresses interference caused by unnecessary electromagnetic waves between components mounted on a substrate. Background technique [0002] In a module in which a plurality of components are mounted on a substrate, shielding portions may be provided between the components in order to suppress interference caused by unnecessary electromagnetic waves between the components. As such a module provided with a shield between components, there are, for example Figure 13 The circuit module 100 described in Patent Document 1 is shown. [0003] The circuit module 100 includes a wiring board 110 , a plurality of electronic components 120 arranged on the wiring board 110 , a sealing layer 130 sealing the electronic components 120 , and a conductive shield 140 covering the sealing layer 130 . [0004] The conductive shield 140 has a first shield portion 141 , a second shield portion 142 , and a th...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K9/00H01L23/28
CPCH05K9/00H01L2924/3025H01L2224/16227H01L2924/15313H01L2924/19106H01L2924/1815H01L23/3121H01L23/552H01L25/18H01L25/16H01L25/0655H01L2224/81815H01L2224/81192H01L24/13H01L24/16H01L24/81H01L2224/131H01L2924/00014H01L2924/014H01L25/0652
Inventor 藤井亮宏森本裕太
Owner MURATA MFG CO LTD