Methods of bonding electronic components
A technology of electronic components and synthetic rubber, which is applied in the manufacture of electrical components, circuits, semiconductors/solid-state devices, etc., can solve problems affecting product yield, uneven surface of circuit substrates, etc., and achieve the effect of improving insufficient structural strength
Active Publication Date: 2021-10-08
UNIMICRON TECH CORP
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AI Technical Summary
Problems solved by technology
In addition to the above-mentioned structure, there are factors such as process tolerances that cause the surface of the circuit board to appear uneven.
In the subsequent process of packaging electronic components, if the flatness of the circuit substrate is too poor, failure modes such as free welding will often occur, which will affect the product yield.
Method used
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Embodiment Construction
[0021] In order to make the description of the present invention more detailed and complete, a descriptive description is presented with the embodiment of the present invention; however, this is not implemented or implemented in unique form of the specific embodiment of the present invention. The various embodiments disclosed below may be combined or substituted in a beneficial case, and other embodiments may be added in an embodiment without further description or description.
[0022] In the following description, many specific details will be described in detail to enable the reader to fully understand the following examples. However, embodiments of the present invention can be practiced without such specific details. In other cases, in order to simplify the drawings, well-known structures and devices are schematically illustrated in the drawings.
[0023] An embodiment of the present invention is to provide a method of engaging an electronic component, which can improve the fa...
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The invention discloses a method for bonding electronic components, comprising the following operations: providing a circuit substrate, which has a top surface and a bottom surface opposite to the top surface, the circuit substrate includes a cavity, which is depressed from the bottom surface toward the top surface, Wherein the circuit substrate has a thickness. A first buffer layer is formed on the packaging platform, and the thickness of the first buffer layer is greater than that of the circuit substrate. A second buffer layer is formed on the jig, and the thickness of the second buffer layer is greater than that of the circuit substrate. The circuit substrate is placed between the packaging platform and the jig, wherein the bottom surface contacts the first buffer layer, the jig fixes the peripheral portion of the top surface of the circuit substrate, and the peripheral portion of the top surface contacts the second buffer layer. Electronic components are disposed on the top surface of the circuit substrate. Therefore, the method for bonding electronic components of the present invention can improve failure modes such as empty soldering that occur when packaging electronic components.
Description
Technical field [0001] The present invention relates to a method of engaging an electronic component, particularly a method of joining an electronic component to a substrate. Background technique [0002] Flip Chip Bonding Technology (FC) is a package technology that connects electronic components to the carrier (Carrier), which mainly uses the surface array, and will use multiple welding pads (pad) ) Configure a bump or solder ball (Solder Ball) on the welding pad, and then the electronic component is over (FLIP), and then through these bumps or solder balls. The welding pad of the surface of the electronic component is electrically connected to the contact on the carrier plate, so that the electronic component can be electrically connected to the carrier plate via a bump or solder ball, and via The inner line of the carrier is electrically connected to an external electronic device. [0003] The carrier plate (e.g., a line substrate) typically comprises a line such as a line, a...
Claims
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IPC IPC(8): H01L21/50H01L21/52
CPCH01L21/50H01L21/52
Inventor 曾晨威李宗桦李少谦
Owner UNIMICRON TECH CORP