Method of bonding electronic components
A technology of electronic components and synthetic rubber, which is applied in the manufacture of electrical components, circuits, semiconductors/solid-state devices, etc., can solve problems affecting product yield, uneven surface of circuit substrates, etc., and achieve the effect of improving insufficient structural strength
Active Publication Date: 2020-01-07
UNIMICRON TECH CORP
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Problems solved by technology
In addition to the above-mentioned structure, there are factors such as process tolerances that cause the surface of the circuit board to appear uneven.
Method used
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[0021] In order to make the description of the content of the present invention more detailed and complete, the following provides an illustrative description for the implementation examples and specific embodiments of the present invention; but this is not the only form for implementing or using the specific embodiments of the present invention. The various embodiments disclosed below can be combined or replaced with each other when beneficial, and other embodiments can also be added to one embodiment, without further description or illustration.
[0022] In the following description, numerous specific details will be set forth in order to enable readers to fully understand the following embodiments. However, embodiments of the invention may be practiced without these specific details. In other instances, well-known structures and devices are only schematically shown in order to simplify the drawings.
[0023] An embodiment of the present invention provides a method for bond...
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Abstract
A method of bonding electronic components includes the following steps: providing a circuit substrate having a top surface and a bottom surface opposite the top surface, wherein the circuit substrateincludes a recess recessed from the bottom surface toward the top surface, and the circuit substrate has a certain thickness; forming a first buffer layer on the packaging platform, wherein the thickness of the first buffer layer is greater than that of the circuit substrate; and forming a second buffer layer on the jig, wherein the thickness of the second buffer layer is greater than that of thecircuit substrate; placing a circuit substrate between the packaging platform and the jig, wherein the bottom surface is in contact with the first buffer layer, the jig fixes the peripheral part of the top surface of the circuit substrate, and the peripheral part of the top surface is in contact with the second buffer layer; and configuring the electronic components on the top surface of the circuit substrate. Therefore, the method for bonding the electronic components can improve failure modes such as missing solder generated when the electronic components are packaged.
Description
technical field [0001] The present invention relates to a method for bonding electronic components, in particular to a method for bonding electronic components to substrates. Background technique [0002] Flip Chip Bonding Technology (FC for short) is a packaging technology that connects electronic components to a carrier. It mainly uses an area array to connect multiple pads ) is placed on the active surface of the electronic component, and a bump or solder ball is formed on the solder pad, and then the electronic component is flipped, and then passed through these bumps or solder balls The solder pads on the surface of the electronic components are electrically and structurally connected to the contacts on the carrier board, so that the electronic components can be electrically connected to the carrier board through bumps or solder balls, and then through The internal circuits of the carrying board are electrically connected to external electronic devices. [0003] The c...
Claims
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Login to View More IPC IPC(8): H01L21/50H01L21/52
CPCH01L21/50H01L21/52
Inventor 曾晨威李宗桦李少谦
Owner UNIMICRON TECH CORP