Zirconia ceramic back plate and processing method thereof

Abstract

The invention relates to a processing method for a zirconia ceramic backboard. The processing method for preparing a zirconia ceramic backboard at least includes the following steps: mixing the materials required for preparing a ceramic layer matrix and whose skeleton material is yttrium-stabilized zirconia After grinding, perform powder molding to obtain a ceramic layer green body; perform at least one surface modification on the ceramic layer green body to stably compound a thermosetting transition layer with a thickness of more than nanometers on the surface of the ceramic layer green body for transferring stress; obtain a The memory deformation layer with a thickness of more than nanometers and used for applying stress is subjected to at least one surface modification so that it can be stably compounded on the surface of the thermosetting transition layer; the memory deformation layer, the thermosetting transition layer and the ceramic layer are shared Form a multi-layer composite structure; under certain physical or chemical stimuli, the multi-layer composite structure is driven by the memory deformation layer to form an expected bending arc, and the size and surface processing are performed to obtain a zirconia ceramic backplane.

Description

technical field [0001] The invention relates to the technical field of mobile phone back plates, in particular to a zirconia ceramic back plate and a processing method thereof. Background technique [0002] As a mobile phone backplane, its material is required to have less shielding of electronic signals and high strength, followed by aesthetic requirements. Likewise, the backplanes of other electronic devices also have the same requirements. The backplane materials of mobile phones are mainly plastic, metal, glass and ceramics. Due to its good appearance, texture, heat dissipation, and toughness, the metal backplane can meet the requirements of thinner and lighter mobile phones, and is currently the mainstream configuration of mid-to-high-end mobile phones. With the advent of the era of 5G networks and wireless charging, smartphones have higher and higher requirements for signal transmission, and metal backplanes have a greater effect on signal shielding. The current main...

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Problems solved by technology

[0007] However, due to the methods for preparing zirconia ceramics provided by the above-mentioned patents in the prior art, most of them adopt dry pressing and injection molding, and dry pressing and injection molding are only suitable for forming thick parts with a thickness greater than 1 mm. Common plastic mobile phone cases It is only 0.4mm. The above two methods are not suitable for the actual ceramic cover production process. For large-sized, thin-walled mobile phone back covers, it is difficult to avoid the uneven molding pressure caused by these two molding methods. The uneven density of the material leads to the problem that the workpiece is easily deformed and cracked during the sintering process

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