Adhesive applying device of semi-solid adhesive
A gluing device and semi-solid technology, applied in the field of gluing, can solve problems such as the difficulty in controlling the thickness of the glue layer and the inability to clean up overflowing glue in time
Active Publication Date: 2020-03-24
CHANGCHUN INST OF OPTICS FINE MECHANICS & PHYSICS CHINESE ACAD OF SCI
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- Claims
- Application Information
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Problems solved by technology
[0003] The purpose of the present invention is to provide a semi-solid glue coating device to solve the problem that the thickness of the glue layer is difficult to control when manually applying semi-solid glue, and the glue overflow cannot be cleaned up in time
Method used
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Embodiment 1
[0026] refer to Figure 1-Figure 5 , a glue application device for semi-solid glue, comprising a glue chamber base 9, a glue chamber sealing cover 8, a glue layer thickness adjustment plate 10, a glue injection assembly, and a glue overflow assembly, and one side of the glue chamber base 9 includes a glue injection groove and the overflow groove, two bosses are set on the seal cover 8 of the glue chamber, and the two bosses are respectively matched and sealed with the glue injection groove and the overflow groove to form the glue injection chamber and the overflow glue chamber; the glue injection assembly The glue chamber seal cover 8 is connected with the glue injection chamber for injecting glue into the glue injection chamber. The overflow glue assembly is connected with the glue overflow chamber through the glue chamber seal cover 8 for recycling overflow glue. The glue chamber base 9 is perpendicular to the glue injection The two opposite outer sides of the surface are pr...
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The invention provides an adhesive applying device of a semi-solid adhesive. The device comprises an adhesive chamber base, an adhesive chamber sealing cover, adhesive layer thickness adjusting plates, an adhesive injection assembly and an adhesive spilling assembly. One side of the adhesive chamber base comprises an adhesive injection groove and an adhesive spilling groove. Two bosses are arranged on the adhesive chamber sealing cover. The two bosses are matched with the adhesive injection groove and the adhesive splitting groove respectively and are in sealed connection with the adhesive injection groove and the adhesive splitting groove to form an adhesive injection chamber and an adhesive splitting chamber. The adhesive injection assembly is connected with the adhesive injection chamber through the adhesive chamber sealing cover for injecting an adhesive into the adhesive injection chamber. The adhesive splitting assembly is connected with the adhesive splitting chamber through theadhesive chamber sealing cover and used for recycling spilled adhesives. The two opposite outer side faces, perpendicular to the adhesive applying face, of the adhesive chamber base are provided withthe movable adhesive layer thickness adjusting plates. The adhesive layer thickness adjusting plates are used for controlling the thickness of the adhesive layer. The adhesive applying device can beoperated by hand, the function of synchronously performing adhesive applying and spilled adhesive removal is achieved, and the semi-solid adhesive applying thickness can be adjusted and controlled.
Description
technical field [0001] The invention relates to the technical field of gluing, and more specifically, to a gluing device for semi-solid glue. Background technique [0002] Bonding is one of the commonly used connection methods between carbon fiber composite parts. The control of the thickness of the glue layer during glue application affects the bonding strength between parts, and the level of glue cleaning operation affects the appearance of the product after bonding. Semi-solid adhesives with limited operating time are commonly used for bonding between carbon fiber composite parts. Once this kind of glue is prepared, it must be applied within a limited time and kept still. This requires the realization of glue thickness control and glue overflow cleaning within a limited time. Traditional hand-held gluing tools (such as scrapers, brushes, etc.) cannot realize gluing and overflow cleaning at the same time in one gluing stroke, and it is difficult to control the thickness...
Claims
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Login to View More IPC IPC(8): B05C17/01
CPCB05C17/0106B05C17/014
Inventor 赵浩江薛闯董吉洪
Owner CHANGCHUN INST OF OPTICS FINE MECHANICS & PHYSICS CHINESE ACAD OF SCI