High-temperature-resistant flexible array antenna and manufacturing method thereof

An array antenna, high-temperature flexible technology, applied in antennas, antenna arrays, and devices for manufacturing antenna arrays, etc., can solve problems such as unsuitable antenna development needs, weak ability to receive signals in multiple directions, and limited directivity of a single antenna. To achieve the effect of broadening the diversity of radiation and reception, being flexible and reducing the volume

Active Publication Date: 2020-04-10
INST OF FLEXIBLE ELECTRONICS TECH OF THU ZHEJIANG +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] In addition, the directivity of a single antenna is limited. When the antenna is working, the ability to receive multi-directional signals is weak, which is not suitable for the development needs of current antennas.

Method used

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  • High-temperature-resistant flexible array antenna and manufacturing method thereof
  • High-temperature-resistant flexible array antenna and manufacturing method thereof
  • High-temperature-resistant flexible array antenna and manufacturing method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0087] A circular alumina-based ceramic material substrate 22 with a thickness of 0.1 mm and a diameter of 10 mm is drilled through a hole 41, placed in a beaker with absolute ethanol, cleaned for 5 minutes in an ultrasonic wave with a power of 40 W, and the substrate 22 is taken out. And dry at 100° C., and form a high-temperature silver paste layer on the substrate 22 by using a screen printing process. The patterned screen during screen printing has a mesh of 200 meshes and a squeegee angle of 30°. After the silk screen printing is completed, the silver paste layer is dried to form the metal layer 23 , and the hole metal layer 42 is formed by stuffing the metal paste into the through hole 41 and drying.

[0088] Place a flexible mica sheet 10 with a thickness of 10 μm in a vacuum chamber and evacuate to 3×10 -3 Pa. Fill the vacuum chamber with Ar so that the vacuum degree is 0.1Pa, turn on the power supply of the heater, heat the flexible mica sheet 10 to 50°C, turn on the...

Embodiment 2

[0091] Place a square magnesium titanate-based ceramic substrate 22 with a thickness of 2mm and a side length of 10mm in a beaker filled with absolute ethanol, clean it in an ultrasonic wave with a power of 40W for 30min, take out the substrate 22 and bake it at 100°C Drying, using 3D printing to form a high-temperature platinum paste on the surface and side walls of the substrate 22 , and drying the platinum paste layer to form the metal layer 23 and the side wall metal layer 60 .

[0092] Place a flexible mica sheet 10 with a thickness of 50 μm in a vacuum chamber and evacuate to 3×10 -3 Pa. Fill the vacuum chamber with O 2 , so that the vacuum degree is 0.5 Pa, turn on the power supply of the heater, heat the flexible mica sheet 10 to 150°C, turn on the Plasma power supply, adjust the voltage to 2000V, and process the flexible mica sheet 10 for 20 minutes through the generated Ar plasma. When the flexible mica sheet 10 is cooled to room temperature in an argon atmosphere,...

Embodiment 3

[0095] Place the mask plate on a circular alumina ceramic substrate 22 with a thickness of 1 mm and a diameter of 10 mm. The entire assembly is placed in a vacuum chamber and evacuated to 3×10 -3 Pa. Fill the vacuum chamber with Ar so that the degree of vacuum is 0.1Pa, turn on the magnetron sputtering power supply, adjust the current to 1A, and carry out magnetron sputtering deposition on the ceramic substrate 22 with the mask plate to lay the underlying metal Ti, and deposit The time is 30 s, the thickness is 10 nm, and then the thickened layer of metal Ag is deposited, the deposition time is 30 min, and the thickness is 2 μm, forming the metal layer 23 and the sidewall metal layer 60 .

[0096] Place a flexible mica sheet 10 with a thickness of 50 μm in a vacuum chamber and evacuate to 3×10 -3 Pa. Fill the vacuum chamber with O 2 , so that the vacuum degree is 0.5Pa, turn on the power supply of the heater, heat the flexible mica sheet 10 to 150°C, turn on the Plasma powe...

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Abstract

The invention discloses a high-temperature-resistant flexible array antenna and a manufacturing method thereof. The antenna takes a flexible mica sheet as a substrate, a plurality of antenna units arearranged on the substrate and are electrically connected through a wire layer, and each antenna unit comprises a metal bonding layer, a chip and a metal pattern layer. The chip is fixed on the flexible mica sheet through the metal bonding layer, the metal pattern layer is arranged at one side, far away from the metal bonding layer, of the chip, and the metal bonding layer is electrically connected with the metal pattern layer. The high-temperature-resistant flexible array antenna can tolerate higher temperature and can be conformal with other objects easily, and the use space is greatly reduced.

Description

technical field [0001] The invention relates to the field of manufacturing flexible antennas, in particular to a high-temperature-resistant flexible array antenna and a manufacturing method thereof. Background technique [0002] Traditional flexible antennas use polymer materials such as PI film, PET film, LCP film, etc. as substrates, through surface metallization, and then patterning to form flexible antennas. However, since polymer materials cannot withstand high temperatures, such as temperatures >500°C, traditional flexible antennas cannot be used at high temperatures. [0003] In inorganic dielectric materials, high temperature resistant materials mainly include glass, ceramics, etc., but ceramic materials cannot be directly used as flexible substrates because they cannot be flexible. Glass can be flexible by reducing its thickness, but because of its smooth surface, it Poor water resistance makes it difficult to form a metallized layer with high strength bonding o...

Claims

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Application Information

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IPC IPC(8): H01Q1/38H01Q1/50H01Q21/00
CPCH01Q1/38H01Q1/50H01Q21/0093
Inventor 冯雪王志建陈颖
Owner INST OF FLEXIBLE ELECTRONICS TECH OF THU ZHEJIANG
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