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Light emitting device

A technology for light-emitting devices and light-emitting chips, which is applied to electrical components, circuits, semiconductor devices, etc., can solve problems such as the decrease in reliability of light-emitting devices, and achieve the effects of increasing cracks, reducing costs, and improving light extraction efficiency.

Pending Publication Date: 2020-04-21
SEOUL VIOSYS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

If cracks occur in the encapsulant, the reliability of the light-emitting device will decrease.

Method used

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  • Light emitting device
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Embodiment Construction

[0020] Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. In order to fully convey the idea of ​​the present invention to those skilled in the art, the embodiments described below are provided as examples. Therefore, the present invention is not limited to the Examples described below, and may be embodied in other forms. In addition, in the drawings, the width, length, thickness, and the like of constituent elements may be exaggerated for convenience of description. Throughout the specification, the same reference symbols represent the same constituent elements, and similar reference symbols represent similar constituent elements.

[0021] According to an embodiment of the present invention, a light emitting device includes a mount substrate, a light emitting chip and a first encapsulant. The light-emitting chip is mounted on the mounting substrate and emits ultraviolet rays. Also, the first encapsulant covers at le...

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Abstract

The present invention relates to a light emitting device. According to an embodiment of the present invention, the light emitting device comprises: a mount substrate; a light emitting chip mounted onthe mount substrate and emitting ultraviolet rays; a first encapsulant covering at least a part of a side surface of the light emitting chip, wherein an external surface of the first encapsulant is formed by a curved surface; and a reflection frame formed on the upper surface of the mounting substrate and formed along the outer side of the first encapsulant. A part of the light emitted from the light emitting chip is refracted toward the upper part of the light emitting chip on the outer surface of the first encapsulant, and the other part of the light emitted from the light emitting chip is reflected toward the upper part of the light emitting chip on the inner wall of the reflection frame.

Description

[0001] This application is a divisional application of a patent application entitled "Light-emitting Device" with an application date of January 8, 2019 and an application number of 201980000924.2. technical field [0002] The invention relates to a light emitting device. Background technique [0003] When a current is applied to a light-emitting diode (LED), light of various wavelengths generated by recombination of electrons and holes is emitted from the junction of p and n-type semiconductors. Demand for light-emitting diodes continues to increase because they have many advantages over filaments used in conventional light-emitting devices, such as long life, low power consumption, and excellent driving characteristics. [0004] A light-emitting diode (hereinafter, referred to as a light-emitting chip) in a chip unit is encapsulated with an encapsulant that functions as a phosphor and a lens, and is applied to a light-emitting device. Light emitted from the light emitting...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/48H01L33/54H01L33/56H01L33/60H01L33/62
CPCH01L33/48H01L33/54H01L33/56H01L33/60H01L33/62
Inventor 李泳陈闵承九朴起延
Owner SEOUL VIOSYS CO LTD