Sensor device and soil environment monitoring method

Abstract

The invention provides a sensor device and a soil environment monitoring method. This sensor device, which is embedded in the soil of a cultivated land and measures the environmental characteristics of the soil, is provided with: an electrode unit having electrodes capable of coming into contact with the soil, and each of which has a plurality of discrete positions formed along the longitudinal direction of a flexible elongated sheet substrate; a detection circuit unit which is provided for each electrode unit and detects an electrical change between a pair of electrodes of the electrode unit;a conductive power supply line part continuously formed on the sheet substrate in the longitudinal direction so as to supply a power supply voltage to each of the detection circuit parts; a conductive signal transmission line part which is continuously formed on the sheet substrate along the length direction in order to transmit the detection signals detected by the detection circuit parts; the storage grooves are provided with closed spaces formed by films passing through water along the discrete positions of the sheet substrate in the length direction, and the seeds planted in the cultivated land are kept in the closed spaces.

Description

[0001] This application is a divisional application of a patent application with an application date of March 28, 2017, an application number of 201780021517.0, and an invention title of "plating treatment method, plating treatment device, and sensor device". technical field [0002] The present invention relates to a plating treatment method for performing plating treatment on a substrate by using an electrolytic plating method, a plating treatment device for implementing the method, and a sensor device formed by using the electrolytic plating method. Background technique [0003] Japanese Patent No. 3193721 discloses a manufacturing method in which, when plating is performed on a conductive material uniformly formed on a substrate, the part to be plated (for example, an electrode to be used) is covered with a resist layer. Parts other than the part) are selectively electroplated to manufacture sensor electrodes for detecting specific components such as glucose. [0004] Ho...

AI Technical Summary

Problems solved by technology

In particular, as a part of the conductive pattern to be overlapped becomes finer, the accuracy of patterning becomes stricter, and the patterning operation becomes difficult.

Therefore, selective plating cannot be easily performed on the portion to be plated.

When the substrate to be electroplated is a flexible thin plate such as a resin film or plastic, there are cases where the expansion and contraction or deformation caused by the influence of the temperature, humidity, tension, etc. of the substrate itself increases to about hundreds of ppm, so it is used for Patterned positioning or registration becomes difficult

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