Contact extrusion type self-centering wafer clamping manipulator

Abstract

The invention discloses a contact extrusion type self-centering wafer clamping manipulator, which comprises a bottom plate, elastic clamping units, supporting pads and a suction plate with a vacuum sucker. Each elastic clamping unit comprises a mounting seat, a slider, a pressing block, an inclined pressing block and a pressing spring, wherein the slider is slidably connected to the mounting seat,the pressing block is arranged on the slider, the two ends of the pressing spring are abutted to the mounting seat and the slider, the inclined pressing block is provided with a pressing slope, the slider is provided with a slope groove matched with the inclined pressing block, and the radius of the suction plate is larger than the distance from the inclined pressing block to the center of the bottom plate. According to the invention, the wafer is not in contact with the three pressing blocks and does not slide in the placing process, so that the risk that the wafer is abraded and scratched is avoided; and meanwhile, the sliding blocks are extruded after the suction plate makes contact with the inclined pressing blocks, so that the pressing blocks are pressed to move outwards, compared with wafer pressing, higher pressing force can be provided, then the pressing blocks can be matched with the pressing springs with higher rigidity, enough clamping force is provided for the pressing blocks to act on the wafer, and clamping is firmer and more stable.

Description

technical field [0001] The invention relates to a contact extrusion type self-centering wafer clamping manipulator. Background technique [0002] In the production process of semiconductor integrated circuits, wafers need to be frequently transferred between different processes. This process involves the operation of grabbing the wafer from the station and placing it on the holding carrier. Most of the current gripper carriers do not have the positioning and clamping function, and the wafer is prone to shift or even slip when it is impacted during the transfer process, resulting in fragments being scrapped. [0003] The invention patent with the patent number of 201210218852.9 proposes a wafer clamping device using spring clips. The wafer clamping device has the function of wafer clamping and positioning, and at the same time does not require too much positioning accuracy when placed with the wafer. Advantages; however, its positioning method of pressing the spring by the w...

AI Technical Summary

Problems solved by technology

Most of the current gripper carriers do not have the positioning and clamping function, and the wafer is prone to shift or even slip when it is impacted during the transfer process, resulting in the scrapping of fragments

[0003] The invention patent with the patent number of 201210218852.9 proposes a wafer clamping device using spring clips. The wafer clamping device has the function of wafer clamping and positioning, and at the same time does not require too much positioning accuracy when placed with the wafer. Advantages; however, its positioning method of pressing the spring by the wafer itself to make the slider retreat will obviously cause damage to the fragile wafer. There is sliding friction between the wafer and the slider, and the debris generated by the friction will also damage the wafer surface. produce secondary pollution; in addition, due to the thin and brittle nature of the wafer itself, it cannot provide enough downward force. To ensure that the wafer can push the slider away smoothly, the spring force must be very small, which in turn causes the spring to fail. Cannot provide enough clamping force to the slider to act on the wafer

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