Unlock instant, AI-driven research and patent intelligence for your innovation.

Chip and Performance Monitoring Method

A chip and performance technology, applied in the field of chip and performance monitoring with built-in test circuit, can solve the problem that the critical path cannot be determined accurately, and achieve the effect of accurate estimation

Active Publication Date: 2022-04-01
GLOBAL UNICHIP CORPORATION +1
View PDF11 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, due to variations introduced by actual operating conditions or processes, the true critical path cannot be accurately determined

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Chip and Performance Monitoring Method
  • Chip and Performance Monitoring Method
  • Chip and Performance Monitoring Method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0016] All terms used herein have their ordinary meanings. The definitions of the above-mentioned words in commonly used dictionaries, and the use examples of any words discussed here in the content of this specification are only examples, and should not limit the scope and meaning of the disclosure. Likewise, the disclosure is not limited to the various embodiments shown in this specification.

[0017] It is understandable that terms such as first, second and third are used herein to describe various elements, components, regions, layers and / or blocks. But these elements, components, regions, layers and / or blocks should not be limited by these terms. These terms are limited to identifying a single element, component, region, layer and / or block. Therefore, a first element, component, region, layer and / or block hereinafter may also be referred to as a second element, component, region, layer and / or block without departing from the original meaning of the present application. ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

A chip and performance monitoring method. The chip includes at least one oscillator circuitry and controller circuitry. At least one oscillator circuit system is arranged at different positions in the chip, and generates a plurality of oscillation signals respectively. The controller circuit system transmits the oscillating signals to an external system to determine a performance of the chip according to the oscillating signals. Each of the at least one oscillator circuitry includes a first oscillator circuit and a second oscillator circuit. The first oscillator circuit senses the variation of the semiconductor device in the chip to generate the first oscillating signal among the oscillating signals. The second oscillator circuit senses the variation of parasitic elements in the chip to generate a second oscillation signal among the oscillation signals. The performance of the chip in this case can be determined according to the frequency of multiple oscillating signals generated in the chip. The multiple oscillating signals are set to reflect various variation factors (device, resistance, voltage, etc.) to more accurately estimate the performance of the chip .

Description

technical field [0001] This case relates to a chip (chip) and a performance monitoring method, and especially relates to a chip with a built-in test circuit and a performance monitoring method. Background technique [0002] Integrated circuits are widely used in electronic devices, and the performance of integrated circuits often determines the overall performance of electronic devices. In some related arts, the performance of integrated circuits can be determined by estimating critical paths. However, due to variations introduced by actual operating conditions or processes, the true critical path cannot be accurately determined. Contents of the invention [0003] In order to solve the above problems, some aspects of the present application provide a chip including at least one oscillator circuit system and a controller circuit system. At least one oscillator circuit system is arranged at different positions in the chip, and is used to generate a plurality of oscillation...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): G01R31/28
CPCG01R31/2851
Inventor 汪鼎豪林倍如
Owner GLOBAL UNICHIP CORPORATION