Heat dissipation material and processing technology thereof

A technology of processing technology and heat-dissipating materials, applied in electrical components, electrical solid-state devices, circuits, etc., to achieve strong strength and toughness, meet heat dissipation requirements, and adjust flexibly.

Active Publication Date: 2020-05-08
深圳市中金岭南鑫越新材料有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] The purpose of the present invention is to provide a heat dissipation material and its processing technology, aiming to solve the problem of heat dissipation of heat dissipation materials in the prior art

Method used

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  • Heat dissipation material and processing technology thereof
  • Heat dissipation material and processing technology thereof
  • Heat dissipation material and processing technology thereof

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Embodiment Construction

[0035] In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0036] In the drawings of this embodiment, the same or similar symbols correspond to the same or similar components; The indicated orientation or positional relationship is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the referred device or element must have a specific orientation, or in a specific orientation. Construction and operation, so the words describing the positional relationship in the drawings are only for illustrative...

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Abstract

The invention relates to the technical field of heat dissipation materials, and discloses a heat dissipation material and a processing technology thereof. The processing technology comprises the following steps of raw material selection, compounding, polishing treatment and annealing treatment. A pure nickel strip and a pure copper strip are calendered and compounded, and the pure nickel strip andthe pure copper strip are combined into a whole through certain positive pressure and mechanical occlusion by fully utilizing the principles of plastic deformation of metal and atomic diffusion between the metal, and a product manufactured through the processing technology has high heat dissipation performance, high strength and high toughness and can fully meet the heat dissipation requirement;the heat dissipation and heat conduction performances can be adjusted by adjusting the thickness ratio of pure copper to pure nickel, the technological adjustment is flexible, only the thickness of metal before compounding needs to be changed, the content and influence of microelements need to be continuously adjusted during smelting, the process is tedious, and the development cost is high; meanwhile, the nickel surface of the product obtained by compounding cannot be rusted even in a temperature rising environment, and the phenomenon of influencing the heat dissipation effect does not exist.

Description

technical field [0001] The invention relates to the technical field of heat dissipation materials, in particular to a heat dissipation material and its processing technology. Background technique [0002] With the intelligent application of mobile phone functions, the quality of life has been greatly improved, and the functional requirements of mobile phones are constantly pursuing more intelligent, which requires mobile phone chips to provide excellent computing power. Of course, high-speed computing and processing will generate heat. The faster the computing speed and the longer the running time, the calorific value will increase accordingly. If the heat is not dissipated in time, the temperature of the mobile phone will gradually rise. It will endanger the safety of the battery and the damage of the chip, so the heat dissipation function of the mobile phone cannot be ignored. [0003] At present, the best heat dissipation materials in mobile phones are mainly copper allo...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/373H01L23/367
CPCH01L23/3736H01L23/3735H01L23/3672
Inventor 覃超郑楠向齐良
Owner 深圳市中金岭南鑫越新材料有限公司
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