Compound, composition for encapsulating photoelectric device, preparation method, encapsulation film, electronic device, and encapsulation method

A technology for optoelectronic devices and encapsulation films, which is applied in the fields of compounds, compositions for optoelectronic device encapsulation, and encapsulation films, and can solve problems such as high water vapor transmission rate

Pending Publication Date: 2020-05-15
JILIN OPTICAL & ELECTRONICS MATERIALS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The purpose of the embodiments of the present invention is to provide a compound, a composition for optoelectronic device packaging, a preparation method, a packaging film, an electronic device, and a packaging method to solve the problem of water vapor transmission in the existing packaging materials for optoelectronic devices proposed in the background technology. high rate problem

Method used

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  • Compound, composition for encapsulating photoelectric device, preparation method, encapsulation film, electronic device, and encapsulation method
  • Compound, composition for encapsulating photoelectric device, preparation method, encapsulation film, electronic device, and encapsulation method
  • Compound, composition for encapsulating photoelectric device, preparation method, encapsulation film, electronic device, and encapsulation method

Examples

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Embodiment 1

[0061] A compound L001, namely the compound numbered L001, the structure of the compound L001 is shown in formula 5:

[0062]

[0063] In this example, the steps of the preparation method of the compound L001 are as follows:

[0064] 1) Weigh 4g of diphenylsilanediol, 8g of (1,3-dimethyldisiloxane-1,1,3,3-tetrayl)tetrakis(propane-3,1-diyl)tetra( 2-methyl acrylate) and 0.6g of p-toluenesulfonic acid were added to a 50mL three-necked flask, stirred for 40 hours, then dissolved in 100mL of toluene, and washed 5 times with deionized water in a separatory funnel; then by rotary evaporation Toluene was removed to obtain the compound L001: (1,5-dimethyl-3,3-diphenyltrisiloxane-1,1,5,5-tetrayl)tetrakis(propane-3,1-di base) tetrakis (2-methyl acrylate) (58% yield).

Embodiment 2

[0066] Weigh 50g of the monomer of the compound L001 prepared by the preparation method in Example 1, mix it with an appropriate amount of component B and 20g of component C, stir at 50°C for 80h under vacuum, and then use a syringe filtering through a filter to obtain the composition for encapsulating photoelectric devices.

[0067] Among them, the component B includes 640g of 2-methyl-2-acrylic acid-1,12-dodecanediol ester and 290g of acrylic acid 2-([1,1′-biphenyl]-2-2-oxo base) ethyl acrylate, and the component C is a photoinitiator 2,4,6-trishydroxymethylbenzoyl diphenylphosphine oxide.

[0068] In this embodiment, the composition for encapsulating optoelectronic devices is coated with a spray agent, according to 100mW / cm 2 Under the conditions of about 10 seconds of irradiation, harden with ultraviolet light to form a coating with a coating thickness of 3 μm; the coating is used as an organic layer (i.e. an organic film), and silicon nitride is used as an inorganic laye...

Embodiment 3

[0070] Compared with Example 2, except that the mass of the monomer of the compound L001 is replaced by 100g, the mass of the 2-methyl-2-acrylic acid-1,12-dodecanediol ester is replaced by 615g, and the The mass of 2-([1,1′-biphenyl]-2-2-oxyl)ethyl acrylate was replaced with 265g, and the others were the same as in Example 2.

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Abstract

The invention relates to the technical field of film packaging, and specifically discloses a compound, a composition for encapsulating a photoelectric device, a preparation method, an encapsulation film, an electronic device and an encapsulation method. The compound has a structure shown in the specification, the compound provided by the invention has relatively low water vapor transmission rate;when the compound is used for preparing the encapsulation film, moisture can be effectively isolated, the transmittance of oxygen and water is low, the service life of a device is prolonged through the encapsulation film, the service life is greatly prolonged on the basis that the flexibility of the device is guaranteed, and the problem that an existing packaging material for a photoelectric device is high in water vapor transmittance is solved. The preparation method of the provided compound is simple, and the provided encapsulation film makes various designs of an organic light-emitting display device possible.

Description

technical field [0001] The invention relates to the technical field of thin film packaging, in particular to a compound, a composition for photoelectric device packaging, a preparation method, a packaging film, an electronic device and a packaging method. Background technique [0002] Organic light-emitting diodes refer to the structure in which a functional organic material layer is inserted between the anode and the cathode. Due to various advantages such as self-brightness, fast response, wide viewing angle, ultra-thin, high-definition and durability, it has been widely used in the field of electronic product manufacturing. widely used. [0003] However, OLEDs have a problem in that organic materials and / or electrode materials may be oxidized due to moisture or oxygen flowing from the outside or gases generated inside or outside the LED, resulting in performance degradation and affecting its lifetime. To overcome these problems, methods such as coating with a photocurabl...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C07F7/08H01L51/52H01L51/56C08F222/14C08F230/08C08F220/30C08F2/48C09D143/04C09D135/02
CPCC07F7/0889C08F222/1006C08F230/08C08F2/48C09D143/04C09D135/02H10K50/8426H10K71/00
Inventor 尹恩心于哲姜晓晨杜磊赵阔马晓宇王辉
Owner JILIN OPTICAL & ELECTRONICS MATERIALS
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