Rapid ultrahigh-resolution detection system for surface defects of semiconductor wafer

Abstract

The invention provides a rapid ultrahigh-resolution detection system for surface defects of a semiconductor wafer. The rapid ultrahigh-resolution detection system comprises an illumination light source; a coupling objective lens, a first polarizing film, a polarization splitting prism, a planar single crystal, a dichroscope and a microscope objective lens which are arranged in a light path of theillumination light source; a first camera which is used for collecting a confocal scanned image; a sample table on which a detected wafer is placed; an evanescent field frequency shift illumination light source arranged around the detected wafer; a dark field illumination light source which is arranged at the periphery of a microscope objective and outputs a light field to obliquely irradiate andilluminate the detected wafer; and a second camera which is used for acquiring the far-field images of the dark field illumination, PL mode illumination and frequency shift illumination. According tothe present invention, a dark field illumination imaging mode, a PL imaging mode and a confocal scanning imaging mode are integrated, the frequency shift illumination defect detection is introduced, and the rapid high-resolution imaging of sub-wavelength size defects can be achieved.

Description

technical field [0001] The invention relates to the field of semiconductor processing and manufacturing, in particular to a fast ultra-high resolution detection system for surface defects of semiconductor wafers. Background technique [0002] The semiconductor defect detection system is used to identify the number of defects in the substrate or epitaxial layer, the area of ​​contamination, and the number of particles on the surface before the production of semiconductor devices, so as to screen the substrate or epitaxial layer and calculate the yield of the device. Key processes. Defect detection runs through the production process, and failure to correct it in time will lead to failure of the final device. In the design, processing, manufacturing and production of integrated circuits, various human and non-human factors lead to errors that are unavoidable, and the resulting waste of resources, dangerous accidents and other costs are even more incalculable. During the test...

AI Technical Summary

Problems solved by technology

Evanescent field frequency-shifted illumination can obtain higher spatial spectrum information of the surface defects of the tested sample, thereby realizing the identification of smaller-sized defects, but the defect detection method and equipment based on frequency-shifted illumination has not yet been reported

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