A fast ultra-high resolution detection system for semiconductor wafer surface defects

Abstract

The present application provides a fast ultra-high-resolution detection system for surface defects of semiconductor wafers, including: an illumination source, and an optical coupling objective lens, a first polarizer, a polarization beam splitter, a planar single crystal, and a dichroic A color mirror and a microscope objective lens; a first camera for collecting confocal scanning images; a sample stage on which a detection wafer is placed; an evanescent field frequency-shifting illumination source arranged around the detection wafer; installed on the The outer periphery of the microscope objective lens and the dark-field illumination light source for oblique incident illumination of the output light field to illuminate the inspected wafer; the second camera is used for dark-field illumination, PL mode illumination and far-field image acquisition of frequency-shift illumination. This application integrates dark-field illumination imaging mode, PL imaging mode and confocal scanning imaging mode, and introduces frequency-shifted illumination defect detection, which can realize fast and high-resolution imaging of sub-wavelength defects.

Description

technical field [0001] The invention relates to the field of semiconductor processing and manufacturing, in particular to a fast ultra-high resolution detection system for surface defects of semiconductor wafers. Background technique [0002] The semiconductor defect detection system is used to identify the number of defects in the substrate or epitaxial layer, the area of ​​contamination, and the number of particles on the surface before the production of semiconductor devices, so as to screen the substrate or epitaxial layer and calculate the yield of the device. Key processes. Defect detection runs through the production process, and failure to correct it in time will lead to failure of the final device. In the design, processing, manufacturing and production of integrated circuits, various human and non-human factors lead to errors that are unavoidable, and the resulting waste of resources, dangerous accidents and other costs are even more incalculable. During the test...

AI Technical Summary

Problems solved by technology

Evanescent field frequency-shifted illumination can obtain higher spatial spectrum information of the surface defects of the tested sample, thereby realizing the identification of smaller-sized defects, but the defect detection method and equipment based on frequency-shifted illumination has not yet been reported

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