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Ultrasonic sensor

An ultrasonic and sensor technology, applied in the field of ultrasonic sensors, can solve the problems of S/N ratio reduction, asymmetry between positive and negative sides, etc.

Active Publication Date: 2020-06-16
DENSO CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0009] However, in the above-mentioned conventional structure 1 and conventional structure 2, in the part where GND is connected to the negative terminal and the microphone case, the circuit configuration is asymmetrical on the positive side and the negative side, which is not canceled when differential amplification is performed by the amplifier.
Therefore, there are problems such as being affected by noise and reducing the S / N ratio.

Method used

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Examples

Experimental program
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Effect test

no. 1 Embodiment approach

[0028] refer to figure 1 , the configuration of the ultrasonic sensor 1 according to the first embodiment will be described. Such as figure 1 As shown, the ultrasonic sensor 1 of the present embodiment is attached to a vehicle by being attached to a bumper B which is a plate-shaped vehicle body member. The bumper B has a bumper outer surface B1 constituting the outer surface of the vehicle and a bumper inner surface B2 as its inner surface. In addition, in the bumper B, an attachment hole B3 that is a through hole for attaching the ultrasonic sensor 1 is formed.

[0029] The ultrasonic sensor 1 has a microphone 2 , a microphone case 3 , a buffer 4 , a circuit board 5 , a sensor case 6 , a sensor connector 7 , and the like, and is attached to a bumper B via a mounting member 8 .

[0030] The microphone 2 converts electrical signals into vibrations or converts vibrations into electrical signals to form an ultrasonic transducer serving as a sound collecting part and a sound em...

no. 2 Embodiment approach

[0063] A second embodiment will be described. This embodiment changes the configuration of the microphone housing 3 and the like from the first embodiment, and the other contents are the same as the first embodiment, so only the parts different from the first embodiment will be described.

[0064] In the first embodiment, the entire microphone case 3 functions as a shield by constituting the entire microphone case 3 with a conductor, but in this embodiment, the entire microphone case 3 is not constituted with a conductor. Instead, a conductor is used to form a part.

[0065] Specifically, as Figure 6 As shown, in this embodiment, the microphone case 3 adopts a structure in which the case main body 3c constituting the outer shape is made of an insulator and has a shielding part 3d partially made of a conductor, thereby exerting a shielding effect. The case main body portion 3c is made of, for example, resin, and has a bottomed cylindrical shape constituting the bottom portio...

no. 3 Embodiment approach

[0070] A third embodiment will be described. This embodiment changes the structure of the shielding part 3d etc. compared with 2nd Embodiment, Since other content is the same as 2nd Embodiment, only the part which differs from 2nd Embodiment is demonstrated.

[0071] Such as Figure 8 As shown, in the present embodiment, the shield portion 3d is formed on the bottom portion 3a of the inner wall surface of the case body portion 3c formed in a cylindrical shape. Further, the microphone 2 is attached to the shield portion 3d via an insulating adhesive 2d made of an insulating adhesive or the like.

[0072] In this way, the microphone case 3 may be constituted by the case main body portion 3c and the shield portion 3d, and the bottom portion 3a of the microphone case 3 may be shielded so as to cover the entire area of ​​the microphone 2 when viewed from the axial direction of the microphone case 3. Part 3d. Even with such a configuration, the same effects as those of the first ...

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Abstract

A negative electrode line (5f) having a negative electrode terminal (2c) connected thereto is isolated from shield parts (3, 3d, 11), and the shield parts (3, 3d, 11) are connected to a ground potential point without being connected to the negative electrode line (5f). As a result of this configuration, the effects of noise including common mode noise can be inhibited while inhibiting a reductionin EMC capacity and ESD capacity. Furthermore, an improvement in the S / N ratio can be achieved.

Description

[0001] Cross References to Related Applications [0002] This application is based on Japanese Patent Application No. 2017-212695 filed on November 2, 2017, the contents of which are incorporated herein by reference. technical field [0003] The present disclosure relates to an ultrasonic sensor having a microphone composed of a piezoelectric vibrating element and performing ultrasonic vibration. Background technique [0004] An ultrasonic sensor is attached to a body part such as a bumper of a vehicle, for example, and detects an obstacle existing near the vehicle by receiving a reflected wave of the ultrasonic wave after generating ultrasonic waves from a microphone. In such an ultrasonic sensor, it is necessary to secure immunity against noise (hereinafter referred to as EMC) and electrostatic discharge (hereinafter referred to as ESD). Therefore, in order to enhance the shielding effect of the microphone case in which the microphone is built, the microphone case is form...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H04R17/00G01S7/521H04R3/00H10N30/20H10N30/88
CPCH04R3/00G01S7/521G01N29/34H04R17/02H04R1/08G01N29/2437G01N29/32G01N2291/011G01N2291/045G01N2291/101H10N30/704H10N30/20H10N30/883
Inventor 小山优
Owner DENSO CORP