Method and device for deploying microservice and electronic equipment

A technology of microservices and compressed packages, which is applied in the field of deploying microservices, can solve the problems of high professional requirements, heavy packaging and construction workload, etc., and achieve the effect of reducing packaging and professional requirements

Pending Publication Date: 2020-06-30
SHENZHEN HONGHE INNOVATION INFORMATION TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] At present, the software installation package under the Linux system generally needs to be compiled, packaged, installed and run under the Linux system. To run the Docker container under the Linux system, it is gener

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  • Method and device for deploying microservice and electronic equipment
  • Method and device for deploying microservice and electronic equipment
  • Method and device for deploying microservice and electronic equipment

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Embodiment Construction

[0032] In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be described in further detail below in conjunction with specific embodiments and with reference to the accompanying drawings.

[0033] It should be noted that all expressions using "first" and "second" in the embodiments of the present invention are to distinguish two entities with the same name but different parameters or parameters that are not the same, see "first" and "second" It is only for the convenience of expression, and should not be construed as a limitation on the embodiments of the present invention, which will not be described one by one in the subsequent embodiments.

[0034] The method for deploying microservices provided by the embodiments of the present invention includes:

[0035] Obtain the source code of the microservice, compile the source code to generate a jar package;

[0036] Obtain the script file corresponding to the m...

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Abstract

The invention discloses a method and device for deploying microservices and electronic equipment, and the method comprises the steps: obtaining a source code of the microservices, and carrying out thecompiling of the source code to generate a jar package; acquiring a script file corresponding to the microservice, wherein the script file is used for installing, configuring and managing the microservice; obtaining a docker mirror image package file corresponding to the micro service; compressing the jar package, the script file and the docker mirror image package file to generate a compressed package of the micro-service; and transmitting the compressed packet of the micro-service to a host installed with a Linux operating system, decompressing the compressed packet of the micro-service under the Linux operating system, and installing and configuring the micro-service. According to the invention, automatic construction and deployment of micro-services can be realized, and the workload and complexity are reduced.

Description

technical field [0001] The present invention relates to the technical field of operating systems, in particular to a method and device for deploying microservices, and electronic equipment. Background technique [0002] Under the microservice architecture, there are a large number of microservices that need to be deployed. It is a common deployment method to package the microservices into a Docker image and realize the functions of the microservices by building, starting, and running the Docker container. [0003] At present, the software installation package under the Linux system generally needs to be compiled, packaged, installed and run under the Linux system. To run the Docker container under the Linux system, it is generally realized by executing commands to build the Docker image and start the Docker container. Packaging, construction, installation and deployment The workload is large and the professional requirements are high. Contents of the invention [0004] In...

Claims

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Application Information

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IPC IPC(8): G06F8/61G06F9/455
CPCG06F8/61G06F9/45558G06F2009/45562
Inventor 戴昌鑫韩卜瓷
Owner SHENZHEN HONGHE INNOVATION INFORMATION TECH CO LTD
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