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Novel working table device capable of reducing bending of edge of base plate

A workbench and edge technology, which is applied in the field of new workbench devices, can solve problems such as single structure and edge bending of the substrate, and achieve the effect of reducing the degree of edge bending and ensuring normal use

Pending Publication Date: 2020-07-10
HITECH SEMICON WUXI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The invention proposes a new workbench device that reduces the bending of the substrate edge, which solves the problem that the existing substrate processing workbench has a single structure and causes the substrate edge to bend

Method used

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  • Novel working table device capable of reducing bending of edge of base plate
  • Novel working table device capable of reducing bending of edge of base plate
  • Novel working table device capable of reducing bending of edge of base plate

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Embodiment Construction

[0018] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention.

[0019] refer to Figure 1-5 , a new type of workbench device that reduces the bending of the substrate edge, including an upper plate 5 and a lower plate 2, and the four corners of the upper plate 5 and the lower plate 2 are rotatably connected with a rotating rod 4, and the circumference of the rotating rod 4 The fixed sleeve of the side wall is provided with a rotating plate 3, and the bottom end of the rotating plate 3 is provided with a chute 7, and the chute 7 is arranged in an arc-shaped structure, and a guide rod 8 is connected between the inner walls of both sides of the chute 7 , the top of the lower plate 2 is connected with four sliders 9 with the same str...

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Abstract

The invention relates to the field of base plate processing, particularly discloses a novel working table device capable of reducing bending of the edge of a base plate, and aims to solve the problemthat an existing base plate processing working table is single in structure to cause that the edge of the base plate bends. According to the scheme, the novel working table device comprises an upper plate and a lower plate; rotating rods are rotatably connected between four corners of the upper plate and four corners of the lower plate; a rotating plate is fixedly arranged on the circumferential side wall of each of the rotating rods in a sleeving manner; a sliding chute is formed in the bottom end of each rotating plate and takes an arc shaped structure; a guide rod is connected between two inner walls of each sliding chute; and sliding blocks with the same structure are connected with the top end of the lower plate and are matched with the sliding chutes. The novel working table device is novel in structure and can correct the defect that the existing working table is single in structure, so that the novel working table device can process base plates with different structure sizes, supports the edge of the base plate, can effectively reduce the edge bending degree of the base plate, ensures normal application of the base plate and is suitable for popularization.

Description

technical field [0001] The invention relates to the field of substrate processing, in particular to a novel workbench device for reducing the bending of substrate edges. Background technique [0002] In the existing chip bonding project, when different products are operated on the workbench, due to the single structure of the workbench, when processing substrates of different sizes, it is easy to cause the edges to bend, which affects the normal use of the substrate. Therefore, To solve such problems, we propose a novel stage setup that reduces the bending of the substrate edge. Contents of the invention [0003] The invention proposes a novel workbench device for reducing the bending of the edge of the substrate, which solves the problem that the existing substrate processing workbench has a single structure and causes the edge of the substrate to bend. [0004] In order to achieve the above object, the present invention adopts the following technical solutions: [0005...

Claims

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Application Information

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IPC IPC(8): B25H1/00
CPCB25H1/00
Inventor 张浩
Owner HITECH SEMICON WUXI
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