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Sensor assembly and method for producing a sensor assembly

A technology of sensor components and sensor elements, which is applied in the direction of measuring instrument components, converting sensor output, and transmitting sensing components with electric/magnetic devices, etc., which can solve the problem of hardened coating material covering, semiconductor sensor elements not being integrated, and no longer being able to Realize pressure transmission and other issues

Active Publication Date: 2020-08-04
ROBERT BOSCH GMBH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in these sensor assemblies, the semiconductor sensor element is not integrated into the housing
In addition, the semiconductor sensor element used for pressure measurement cannot be covered with a hardened encapsulation material in this case, since a pressure transmission to the semiconductor sensor element is no longer possible.

Method used

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  • Sensor assembly and method for producing a sensor assembly

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0019] exist figure 1 A cross-section of the head portion of the sensor assembly 1 is partially shown in FIG.

[0020] The sensor assembly 1 has a holding body 2 made of plastic, for example. The holding body 2 can be produced as an injection-molded part, for example, by injection-molding the metallic punched grid rails 6 . An annular groove 23 is provided on the head part of the holding body 2 , which can be arranged concentrically around the mounting seat 21 . A mounting surface 22 is formed on the end face of the mounting support 21 . Mounting surface 22 is preferably configured as a plane. A preferably elastic, surrounding wall 24 formed on the holding body 2 can be located on both sides of the annular groove 23 , which can protrude beyond the mounting surface 22 in the direction of the mounting surface.

[0021] A component 5 is pressed into the annular groove 23 , which can be, for example, an annular magnet 50 of the sensor arrangement 1 . For this purpose, a clamp...

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PUM

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Abstract

The invention relates to a sensor assembly (1), which detects a retaining body (2) and a housed semiconductor sensor element (4), arranged on the retaining body (2), wherein a cured covering material(3) completely covering the housed semiconductor sensor element (4) is arranged on the retaining body (2). According to the invention, the housed semiconductor sensor element (4) is adhered to a mounting surface (22) of the retaining body (2) by means of an adhesive (71), which differs from the covering material (3), and the adhesive (71) is arranged in a receiving chamber (7) between the mountingsurface (22) and a bottom side (42) of the housed semiconductor sensor element (4) which faces the mounting surface (22).

Description

Background technique [0001] Sensor assemblies with semiconductor sensor elements for rotational speed sensing and / or position sensing are used in various ways in the prior art. For example, a Hall IC component or an ASIC (Application Specific Integrated Circuit) with a Hall IC, which is embedded in a housing, is used as the packaged semiconductor sensor element. This sensor is often combined with a magnetic or non-magnetic sensor wheel for rotational speed sensing. If the sensor wheel with teeth and teeth rotates in front of the sensor assembly, a magnetic field change occurs at the location of the semiconductor sensor element, whereby an electrical signal can be generated as a function of the passing teeth and teeth , the rotational speed of the sensor wheel can be determined from the electrical signal. Additionally or alternatively, such a sensor arrangement can also be used for absolute angular position sensing in combination with a coded sensor wheel, for example, so tha...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01D5/14G01P3/487G01D11/24G01D11/30
CPCG01D5/145G01D11/245G01P3/487G01D11/30G01P1/026
Inventor T·乌尔曼M·埃尔茨纳
Owner ROBERT BOSCH GMBH