Die bonding equipment
An equipment and die-bonding technology, applied in the fields of semiconductor/solid-state device manufacturing, electrical components, circuits, etc., can solve problems such as low production efficiency and non-compliance with production capacity requirements, and achieve the effect of improving lamination efficiency and lamination accuracy.
Pending Publication Date: 2020-08-07
SHENZHEN YUANMINGJIE TECH
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Problems solved by technology
[0002] At present, the die-bonding device is a single-group die-bonding device to position and attach the wafer, resulting in low production efficiency and not meeting the production capacity requirements.
Method used
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Embodiment Construction
[0038] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.
[0039] It should be noted that all directional indications (such as up, down, left, right, front, back...) in the embodiments of the present invention are only used to explain the relationship between the components in a certain posture (as shown in the accompanying drawings). Relative positional relationship, movement conditions, etc., if the specific posture changes, the directional indication will also change accordingly.
[0040] In addition, the ...
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The invention discloses die bonding equipment, and the equipment comprises a rack and a plurality of chip mounting mechanisms. The plurality of chip mounting mechanisms are arranged on the rack in parallel at intervals; each chip mounting mechanism comprises a wafer disc, an ejector pin and an ejector pin; the wafer disc is movably connected to the rack, and the wafer disc is used for bonding a wafer; the ejector pin is movably connected to the rack, the ejector pin is located above the wafer disc, and the ejector pin and the wafer disc are arranged in a spaced mode; a positioning piece is arranged on the rack and located at the side, back on to the wafer disc, of the ejector pin, the positioning piece is provided with a chip mounting position, and the positioning piece is used for containing a chip mounting base material; when the wafer disc moves to the position above the chip mounting position of the positioning piece, the positioning piece is provided with the chip mounting base material, and the ejector pin drives a wafer of the wafer disc to descend so that the wafer can abut against the chip mounting base material. According to the technical scheme, the production efficiencyis improved.
Description
technical field [0001] The invention relates to the technical field of crystal-bonding equipment, in particular to a crystal-bonding equipment. Background technique [0002] At present, the die-bonding device is a single-group die-bonding device to position and attach the wafer, which leads to low production efficiency and does not meet the production capacity requirements. [0003] The above content is only used to assist in understanding the technical solution of the present application, and does not mean that the above content is admitted as prior art. Contents of the invention [0004] The main purpose of the present invention is to provide a crystal bonding equipment, aiming at improving production efficiency. [0005] In order to achieve the above object, a kind of crystal-bonding equipment proposed by the present invention, the crystal-bonding equipment includes: [0006] rack; and [0007] A plurality of placement mechanisms, a plurality of placement mechanisms ...
Claims
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Login to View More IPC IPC(8): H01L21/67
CPCH01L21/67092H01L21/67276
Inventor 蒋仟单佳伟黎理明黎理杰
Owner SHENZHEN YUANMINGJIE TECH