Method of manufacturing mold for diffraction grating light guide plate and method of manufacturing diffraction grating light guide plate
A diffraction grating and light guide plate technology, which is applied in light guides, household appliances, and other household appliances, can solve the problems of thermal deformation of mask film, damage of mold base, and change of mask film, etc.
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[0064] According to an exemplary embodiment of the present invention, the ratio of the flow rate of oxygen to the total flow rate of the gas mixture may be 1% or more and 20% or less. Specifically, the ratio of the flow rate of oxygen to the total flow rate of the gas mixture may be 1% or more and 15% or less, 1% or more and 10% or less, or 1% or more and 5% or smaller. When the ratio of the flow rate of oxygen to the total flow rate of the gas mixture is within the above range, the formation of acicular structures during the process of etching the mold base can be further suppressed, and the size of the formed acicular structures can be significantly reduced.
[0065] According to an exemplary embodiment of the present invention, the second to fourth pattern portions may be formed after the first pattern portion is formed on the mold base, or may be formed after the second to fourth pattern portions are formed on the mold base A first pattern portion is formed.
[0066] Her...
Embodiment approach
[0091] Hereinafter, the Examples will be described in detail to specifically describe the present invention. However, the embodiments according to the present invention can be modified in various forms, and should not be construed as limiting the scope of the present invention to the following embodiments. The examples of this specification are provided to further fully explain the present invention to those skilled in the art.
[0092] Preparation of mask film
Embodiment 1
[0093] Embodiment 1_second mask film
[0094] A polyimide (PI) film having a glass transition temperature of about 280° C., a melting point of about 390° C., and a thickness of about 50 μm was prepared as a base. In addition, a silicon-based adhesive film having a thickness of about 6 μm was prepared as an adhesive layer. Thereafter, a mask film was manufactured by attaching an adhesive film to one surface of the PI film. A sample was manufactured by cutting the manufactured mask film into a width of 2.54 cm and a length of 30 cm, and the sample was attached to one surface of stainless steel 304 . Thereafter, based on the ASTM D3330 evaluation method, the force applied when separating the sample from the stainless steel 304 was measured, and the force was about 60 gf / in.
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Abstract
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