Test chip, integrated circuit test method and system, and detection equipment
A technology of integrated circuits and testing methods, which is applied in electronic circuit testing, non-contact circuit testing, electrical digital data processing, etc., can solve problems such as areas where defects cannot be located, and achieve the effect of simple start-up tasks
Active Publication Date: 2020-08-28
INST OF MICROELECTRONICS CHINESE ACAD OF SCI
View PDF10 Cites 2 Cited by
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
For example: central processing unit chip, low-speed peripheral interface chip and memory chip, etc., respectively observe whether each test chip is in normal use, if a test chip cannot be used normally, then locate the manufacturing defect of the new process under the test chip
[0003] In order to simplify the test process of the new process, a test chip with a complex structure is used for testing. The test result of the new process can only be whether the test chip is in normal use, and it is impossible to locate the defective area under the new process.
Method used
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View moreImage
Smart Image Click on the blue labels to locate them in the text.
Smart ImageViewing Examples
Examples
Experimental program
Comparison scheme
Effect test
Embodiment Construction
[0035] In order to clearly describe the technical solutions of the embodiments of the present invention, in the embodiments of the present invention, words such as "first" and "second" are used to distinguish the same or similar items with basically the same function and effect. For example, the first threshold and the second threshold are only used to distinguish different thresholds, and their sequence is not limited. Those skilled in the art can understand that words such as "first" and "second" do not limit the number and execution order, and words such as "first" and "second" do not necessarily limit the difference.
[0036] It should be noted that, in the present invention, words such as "exemplary" or "for example" are used as examples, illustrations or illustrations. Any embodiment or design described herein as "exemplary" or "for example" should not be construed as being preferred or advantageous over other embodiments or designs. Rather, the use of words such as "ex...
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More PUM
Login to View More Abstract
The invention discloses a test chip, an integrated circuit test method, an integrated circuit test system and detection equipment and relates to the field of integrated circuit test, thereby solve a problem of providing a novel process for testing an integrated circuit in one test chip. The test chip includes an on-chip bus system, a selector in communication with the on-chip bus system, and a processor in communication with the on-chip bus system. The integrated circuit test method comprises the above technical scheme. The provided test chip and test method of an integrated circuit are used for determining components with manufacturing defects in a new process of testing on one test chip.
Description
technical field [0001] The invention relates to the field of integrated circuit testing, in particular to a testing chip, an integrated circuit testing method and system, and testing equipment. Background technique [0002] In the development process of integrated circuits, multiple test chips can be used to test whether the new process is suitable for integrated circuit manufacturing. For example: central processing unit chip, low-speed peripheral interface chip and memory chip, etc., respectively observe whether each test chip is in normal use, if a test chip cannot be used normally, then locate the manufacturing defect of the new process under the test chip. [0003] In order to simplify the test process of the new process, a test chip with a complex structure is used for testing. The test result of the new process can only be whether the test chip is in normal use, and cannot locate the defective area under the new process. Contents of the invention [0004] The objec...
Claims
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More Application Information
Patent Timeline
Login to View More Patent Type & Authority Applications(China)
IPC IPC(8): G01R31/303G06F15/78
CPCG01R31/303G06F15/7807
Inventor 郭桂良徐梓文胡佳威
Owner INST OF MICROELECTRONICS CHINESE ACAD OF SCI