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A test chip, integrated circuit test method and system and testing equipment

A test method and integrated circuit technology, applied in electronic circuit testing, non-contact circuit testing, electrical digital data processing, etc., can solve problems such as areas where defects cannot be located, and achieve the effect of simple start-up tasks

Active Publication Date: 2022-07-08
INST OF MICROELECTRONICS CHINESE ACAD OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

For example: central processing unit chip, low-speed peripheral interface chip and memory chip, etc., respectively observe whether each test chip is in normal use, if a test chip cannot be used normally, then locate the manufacturing defect of the new process under the test chip
[0003] In order to simplify the test process of the new process, a test chip with a complex structure is used for testing. The test result of the new process can only be whether the test chip is in normal use, and it is impossible to locate the defective area under the new process.

Method used

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  • A test chip, integrated circuit test method and system and testing equipment
  • A test chip, integrated circuit test method and system and testing equipment
  • A test chip, integrated circuit test method and system and testing equipment

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Embodiment Construction

[0035] In order to clearly describe the technical solutions of the embodiments of the present invention, in the embodiments of the present invention, words such as "first" and "second" are used to distinguish the same or similar items with basically the same function and effect. For example, the first threshold and the second threshold are only used to distinguish different thresholds, and the sequence of the first threshold is not limited. Those skilled in the art can understand that the words "first", "second" and the like do not limit the quantity and execution order, and the words "first", "second" and the like are not necessarily different.

[0036] It should be noted that, in the present invention, words such as "exemplary" or "for example" are used to represent examples, illustrations or illustrations. Any embodiment or design described herein as "exemplary" or "such as" should not be construed as preferred or advantageous over other embodiments or designs. Rather, the...

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Abstract

The invention discloses a test chip, an integrated circuit testing method, system and testing equipment, which relate to the field of integrated circuit testing and solve a new process for testing integrated circuits in one test chip. The test chip includes: an on-chip bus system; a selector communicating with the on-chip bus system; and a processor communicating with the on-chip bus system. The integrated circuit testing method includes the aforementioned technical solutions. The present invention provides a test chip and a test method for an integrated circuit for determining components with manufacturing defects during testing a new process on a test chip.

Description

technical field [0001] The invention relates to the field of integrated circuit testing, in particular to a testing chip, an integrated circuit testing method and system, and testing equipment. Background technique [0002] In the process of integrated circuit research and development, multiple test chips can be used to test whether the new process is suitable for integrated circuit manufacturing. For example: CPU chips, low-speed peripheral interface chips, and memory chips, etc., respectively observe whether each test chip is in normal use. If a test chip cannot be used normally, it is determined that the new process has manufacturing defects under the test chip. [0003] In order to simplify the test process of the new process, a test chip with a complex structure is used for testing. The test result of the new process can only be whether the test chip is in normal use, and the defective area under the new process cannot be located. SUMMARY OF THE INVENTION [0004] Th...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01R31/303G06F15/78
CPCG01R31/303G06F15/7807
Inventor 郭桂良徐梓文胡佳威
Owner INST OF MICROELECTRONICS CHINESE ACAD OF SCI