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Coil component

A technology of coil components and coil layers, applied in the direction of transformer/inductor coil/winding/connection, electrical components, parts of transformer/inductor, etc., can solve the problems of lower quality factor, difficulty in ensuring high capacity, increase, etc.

Pending Publication Date: 2020-09-15
SAMSUNG ELECTRO MECHANICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] If the area used to form the coil is reduced in this way, it may become difficult to secure high capacity, and the width of the coil becomes smaller, increasing direct current (DC) and alternating current (AC) resistance and lowering the quality factor ( Q)

Method used

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Embodiment Construction

[0016] Terms used in describing the present disclosure are for describing specific embodiments and are not intended to limit the present disclosure. Unless stated otherwise, singular terms include plural forms. The terms "comprising", "comprising", "constructed to" and the like describing the present disclosure are used to indicate the presence of features, quantities, steps, operations, elements, components or combinations thereof, but do not exclude the combination or addition of one or more Additional features, numbers, steps, operations, elements, components or combinations thereof. In addition, the terms "disposed on", "located on", etc. may indicate that an element is located above or below an object, and does not necessarily mean that the element is located above or below the object with respect to the direction of gravity.

[0017] The terms "coupled to", "combined to", etc. may not only indicate that elements are directly and physically in contact with each other, bu...

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Abstract

The disclosure provides a coil component. The coil component includes a body; a first substrate disposed inside of the body, and a second substrate, disposed below the first substrate; a first coil layer disposed on an upper surface of the first substrate; a second coil layer disposed between the first substrate and the second substrate; a third coil layer disposed on a lower surface of the secondsubstrate; a conductive via passing through the first substrate and connecting the first coil layer and the second coil layer to each other; a connection electrode disposed outside of the body and connecting the second coil layer and the third coil layer to each other; a first external electrode disposed outside of the body and connected to the first coil layer; and a second external electrode disposed outside of the body and connected to the third coil layer.

Description

[0001] This application claims the benefit of priority from Korean Patent Application No. 10-2019-0025970 filed with the Korean Intellectual Property Office on March 6, 2019, the disclosure of which is hereby incorporated by reference in its entirety. technical field [0002] The present disclosure relates to a coil assembly. Background technique [0003] In recent years, miniaturization and thinning of information technology (IT) devices such as various communication devices, display devices, and the like have accelerated. Research into the miniaturization and thinning of various devices such as inductors, capacitors, transistors, etc. employed in such IT devices has been continuously conducted. As a result, inductors have rapidly transformed into chips capable of both miniaturization and high-density automatic surface mounting. In addition, film-type inductors manufactured by plating the upper and lower surfaces of the substrate to form a coil pattern, mixing magnetic pow...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01F27/28H01F27/29H01F27/32H01F27/245H01F27/02
CPCH01F27/28H01F27/2847H01F27/2852H01F27/29H01F27/022H01F27/32H01F27/324H01F27/245H01F17/0013H01F27/292H01F27/2804H01F17/0006H01F2027/297H01F2017/002H01F2017/0073H01F27/323
Inventor 李东珍李东焕安永圭尹灿沈原徹
Owner SAMSUNG ELECTRO MECHANICS CO LTD