Heat dissipation and shock absorption base for electronic product transportation
A technology for shock-absorbing bases, electronic products, applied in the direction of transportation and packaging, types of packaging items, impact-sensitive items, etc., can solve problems such as economic loss, trouble, and reduced practicability of transportation devices
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Embodiment 1
[0019] like figure 1 As shown, the present application provides a thermal and shock-absorbing base for electronic product transportation, which at least includes a base body 1 and a receiving seat 2 . The base body 1 has a hollow cavity 6 for placing electronic products. The receiving seat 2 can be arranged in the hollow cavity 6, and when the receiving seat 2 is subjected to an external force, it can move along the extension direction of the external force. Specifically, sliding protrusions 7 may be provided on both sides of the receiving seat 2 . Sliding grooves 8 may be provided on both sides of the hollow cavity 6 . By nesting the sliding protrusion 7 in the sliding groove 8 , the receiving base 2 can slide along the extending direction of the sliding groove 8 . The hollow cavity 6 can be divided into a first cavity 6 a and a second cavity 6 b by the socket 2 . Electronic products to be transported can be arranged on the receiving seat 2 in a manner of being located in...
Embodiment 2
[0027] like figure 1 As shown, the heat dissipation and shock absorption base of the present application further includes a sealing cover 12 capable of sealing the base body 1 . The sealing cover 12 can ensure that the electronic product is completely located in the first cavity 6a, thereby preventing foreign objects from falling into the first cavity 6a to cause damage to the electronic product. The hollow cavity 6 is provided with a heat dissipation mechanism 13 for heat dissipation and cooling of electronic products. The heat dissipation mechanism 13 at least includes an air cylinder 13a, an extrusion part 13b, an air intake channel 13c, an exhaust channel 13d, a heat exchange part 13e and a buffer part 13f. The air cylinder 13a is disposed in the second cavity 6b. The extrusion part 13b can be connected with the first rod body 9, and then the extrusion part 13b can be driven to move synchronously by the sliding of the first rod body 9, that is, when the third shock absor...
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