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Heat dissipation and shock absorption base for electronic product transportation

A technology for shock-absorbing bases, electronic products, applied in the direction of transportation and packaging, types of packaging items, impact-sensitive items, etc., can solve problems such as economic loss, trouble, and reduced practicability of transportation devices

Inactive Publication Date: 2020-10-20
杭州鹿扬科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] In real life, electronic products are becoming more and more common nowadays, and it has become very important to the transportation safety of electronic products. The shock absorption effect of the current transportation device is poor, and it cannot effectively protect electronic products well, which is easy to cause electronic The damage of the product reduces the practicability of the transportation device, causes unnecessary troubles to people, and often causes certain economic losses during transportation.

Method used

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  • Heat dissipation and shock absorption base for electronic product transportation

Examples

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Comparison scheme
Effect test

Embodiment 1

[0019] like figure 1 As shown, the present application provides a thermal and shock-absorbing base for electronic product transportation, which at least includes a base body 1 and a receiving seat 2 . The base body 1 has a hollow cavity 6 for placing electronic products. The receiving seat 2 can be arranged in the hollow cavity 6, and when the receiving seat 2 is subjected to an external force, it can move along the extension direction of the external force. Specifically, sliding protrusions 7 may be provided on both sides of the receiving seat 2 . Sliding grooves 8 may be provided on both sides of the hollow cavity 6 . By nesting the sliding protrusion 7 in the sliding groove 8 , the receiving base 2 can slide along the extending direction of the sliding groove 8 . The hollow cavity 6 can be divided into a first cavity 6 a and a second cavity 6 b by the socket 2 . Electronic products to be transported can be arranged on the receiving seat 2 in a manner of being located in...

Embodiment 2

[0027] like figure 1 As shown, the heat dissipation and shock absorption base of the present application further includes a sealing cover 12 capable of sealing the base body 1 . The sealing cover 12 can ensure that the electronic product is completely located in the first cavity 6a, thereby preventing foreign objects from falling into the first cavity 6a to cause damage to the electronic product. The hollow cavity 6 is provided with a heat dissipation mechanism 13 for heat dissipation and cooling of electronic products. The heat dissipation mechanism 13 at least includes an air cylinder 13a, an extrusion part 13b, an air intake channel 13c, an exhaust channel 13d, a heat exchange part 13e and a buffer part 13f. The air cylinder 13a is disposed in the second cavity 6b. The extrusion part 13b can be connected with the first rod body 9, and then the extrusion part 13b can be driven to move synchronously by the sliding of the first rod body 9, that is, when the third shock absor...

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PUM

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Abstract

The invention discloses a heat dissipation and shock absorption base for electronic product transportation. The heat dissipation and shock absorption base comprises a base body, a bearing seat, a first shock absorption mechanism, a second shock absorption mechanism and a third shock absorption mechanism, the bearing seat is arranged in the base body, and the first shock absorption mechanism, the second shock absorption mechanism and the third shock absorption mechanism can be coupled with the bearing seat, wherein in the process that impact borne by the base body is transmitted to the bearingseat, the impact can be sequentially absorbed by the third shock absorption mechanism, the second shock absorption mechanism and the first shock absorption mechanism. When the base body is impacted, the impact can be sequentially absorbed by the third damping mechanism, the second damping mechanism and the first damping mechanism, and the damping effect can be improved through a multi-stage damping mechanism.

Description

technical field [0001] The invention belongs to the field of transportation auxiliary equipment, and in particular relates to a heat dissipation and shock absorption base for electronic product transportation. Background technique [0002] In real life, electronic products are becoming more and more common nowadays, and it has become very important to the transportation safety of electronic products. The shock absorption effect of the current transportation device is poor, and it cannot effectively protect electronic products well, which is easy to cause electronic The damage of the product reduces the practicability of the transportation device, causes unnecessary troubles to people, and often causes certain economic losses in the transportation process. Therefore, in the prior art, there are many heat-dissipating and shock-absorbing bases with different functions. For example, the patent document whose publication number is CN107218482A discloses a heat dissipation and sh...

Claims

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Application Information

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IPC IPC(8): B65D81/02B65D25/02B65D81/18
CPCB65D25/02B65D81/02B65D81/18
Inventor 不公告发明人
Owner 杭州鹿扬科技有限公司