Accelerometer based on two-dimensional and three-dimensional hybrid printing method

Abstract

The invention discloses an accelerometer based on a two-dimensional and three-dimensional hybrid printing method. A three-dimensional printing part and a two-dimensional printing part are integrated in the same printer and share the same printing platform and heating device to realize accurate alignment and accurate control during hybrid printing; a mechanical structure of a device is manufacturedby using an insulating material and the three-dimensional printing part; the melting point of the insulating material is higher than the sintering temperature of low-temperature conductive ink and the insulating material has relatively low thermal shrinkage; meanwhile, the roughness of the three-dimensional printing part is less than 100 microns to ensure that the subsequent conductive ink can form a continuous track on the surface of the mechanical structure; then an electrode and lead interconnection structure of the device is printed on the surface of the mechanical structure of the deviceby using the low-temperature conductive ink; and finally, a complete device is obtained.

Description

technical field [0001] The invention relates to the field of electronic technology, in particular to a two-dimensional and three-dimensional hybrid manufacturing method of an accelerometer. Background technique [0002] Electronic sensors such as accelerometers, pressure sensors, gyroscopes, etc. are widely used in industrial production and people's daily life. The manufacturing methods of these sensors are usually based on silicon-based microelectronics processes such as deposition, photolithography, etching and metallization in centralized chemical factories, which usually take several months, not only the production cycle is long, but also the product models are few, High transportation costs...difficult to meet the growing demand of users for personalized customization. Distributed 3D printing technology provides an efficient manufacturing method for personalized customization. However, at present, 3D printing mainly uses insulating materials such as polymer resins. Al...

AI Technical Summary

Problems solved by technology

However, at present, 3D printing mainly uses insulating materials such as polymer resins. Although these can provide good mechanical structures and insulation isolation for electronic devices, they cannot form good interconnections between electrodes and leads. Therefore, the current 3D printing technology is in Difficulties in application in the field of electronic device manufacturing

[0003] Although methods such as evaporation coating, sputtering coating and wet chemical plating provide some solutions for metallization on the surface of insulating materials, these metallization methods are not only complicated in process, high in cost, but also not selective, that is, they cannot be patterned but Whole surface coating

If patterning operations such as photolithography and development are performed on the device first, and then these traditional processes are used for metallization, although metal patterns can be selectively grown on the surface of insulating materials, the processes such as photolithography, development and stripping further increase the process. complexity and manufacturing cost

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