Bending die for electronic component

Abstract

The invention discloses a bending die for an electronic component. The die comprises a clamping mechanism, a downward pressing mechanism and an upward pushing mechanism, wherein the clamping mechanismcomprises an upper die plate and a lower die plate which are arranged up and down, the upper die plate and the lower die plate have linear degrees of freedom which are vertically close to or far awayfrom each other, the upper die plate and the lower die plate are contacted with each other to clamp the electronic component, the electronic component comprises a pipe head and a pipeline which are connected to each other, the upper die plate and the lower die plate clamp the pipeline, the pipeline is provided with an exposed section which does not make contact with the clamping mechanism and extends horizontally, and the pipe head also extends horizontally and is located on the other side of the exposed section on the clamping mechanism; the upper die plate and the lower die plate clamp thepipeline, the pipeline is provided with an exposed section which does not make contact with the clamping mechanism and extends horizontally, and the pipe head also extends horizontally and is locatedon the other side of the exposed section on the clamping mechanism; and the upward pushing mechanism comprises an upward pushing block located under the exposed section, and the upward pushing block has a vertical reciprocating linear freedom degree. Through adoption of the bending die, the electronic component in a straight state is bent in an L shape or a Z shape, subsequent mounting of the electronic component on a circuit board is facilitated, and the overall efficiency is high.

Description

technical field [0001] The invention relates to the field of molds, in particular to a bending mold for electronic components. Background technique [0002] The structure of electronic components such as diodes and triodes is basically similar. There are several pipelines connected in parallel behind a tube head. When the electronic components are in the state of incoming materials, the length direction of the tube heads and pipelines is generally parallel. Reshaping is often required during board installation, for example, the pipeline needs to be shaped into a special shape to facilitate installation with the circuit board, or to increase reliability after installation. However, the size of the electronic components is small. If the pre-shaping is realized manually, the efficiency will be low and the quality will not be guaranteed. Contents of the invention [0003] The problem to be solved by the present invention is to provide a bending mold for electronic components,...

AI Technical Summary

Problems solved by technology

However, the size of electronic components is small. If the pre-shaping is realized manually, the efficiency will be low and the quality will not be guaranteed.

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