Heat conduction structure of ceramic heater

Abstract

The invention discloses a heat conduction structure of a ceramic heater, which comprises a heat conduction strip, a heat conduction pad is fixedly connected to the middle of the front side wall of theheat conduction strip, four sets of first mounting holes are formed in the four corners of the heat conduction strip in total, and each set comprises two first mounting holes which are symmetricallyformed. A mounting plate is slidably connected to the front side wall of the heat conduction pad and located at the opening of each group of first mounting holes, wherein second mounting holes are formed between the front side wall and the rear side wall of each mounting plate and correspond to the two first mounting holes in the corresponding side. According to the invention, the good fixed installation mechanism is arranged, when the ceramic heater heat conduction structure is actually installed on the ceramic heater, the installation adaptability and the installation convenience are good, in addition, the good heat conduction mechanism is arranged, the actual heat conduction mechanism is good in heat conduction effect, and rapid and efficient heat conduction mechanism replacement is facilitated. Therefore, the structure has excellent practical application value.

Description

technical field [0001] The invention relates to the technical field of heaters, in particular to a heat conduction structure of a ceramic heater. Background technique [0002] When there is no relative displacement between parts of an object or when different objects are in direct contact, the heat transfer generated by the thermal motion of molecules, atoms, free electrons and other microscopic particles of matter is called heat conduction (heat conduction). [0003] At present, heat conduction structures are needed in ceramic heaters. The existing heat conduction structures of ceramic heaters lack a good fixed installation mechanism in actual use. In addition, the lack of good heat conduction mechanism, the actual heat conduction effect of the heat conduction mechanism is mediocre, and it is not conducive to quick and efficient replacement of the heat conduction mechanism, and the actual application value is not high. Contents of the invention [0004] The object of the...

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Problems solved by technology

[0003] At present, heat conduction structures are needed in ceramic heaters. The existing heat conduction structures of ceramic heaters lack a good fixed installation mechanism in actual use. In addition, the lack of good heat conduction mechanism, the actual heat conduction effect of the heat conduction mechanism is average, and it is not conducive to fast and efficient heat conduction mechanism replacement, the actual application value is not high

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