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Packaging structure applied to infrared sensor, and infrared sensor packaging method

An infrared sensor and packaging structure technology, applied in the field of sensors, can solve the problems of high assembly process requirements, high cost, and complex structure, and achieve the effects of simplifying the packaging structure and packaging production process, simple structure, and realizing fixation and protection

Pending Publication Date: 2021-02-26
杭州敏和光电子技术有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0011] The purpose of the present invention is to overcome the problems of many components, complex structure, high assembly process requirements and high cost in the traditional infrared sensor packaging structure in the prior art, and provide a simple structure, low cost and strong applicability for applications Packaging structure of infrared sensor and packaging method of infrared sensor

Method used

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  • Packaging structure applied to infrared sensor, and infrared sensor packaging method
  • Packaging structure applied to infrared sensor, and infrared sensor packaging method
  • Packaging structure applied to infrared sensor, and infrared sensor packaging method

Examples

Experimental program
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Embodiment 1

[0035] This embodiment can be applied to pyroelectric sensors, such as figure 2 The shown packaging structure applied to infrared sensors includes a substrate 5, a sensitive element 7 disposed on the substrate, a supporting circuit 8 for the sensitive element, a metal cap 1 and pins 3; the side of the substrate is closely attached to the inner wall of the metal cap close; the metal pipe cap has a rectangular receiving window 13 of 4mm x 3mm facing the receiving direction, and an infrared filter 4 matching the size of the receiving window is fixedly installed at the receiving window.

[0036] A metal wire is laid on the substrate, and the sensitive element and the supporting circuit of the sensitive element are electrically connected to the substrate through the metal wire and conductive glue to form a sensing circuit; one end of the pin is fixedly installed on the substrate, and is connected through the The conductive glue 12 is electrically connected to the pad on the substr...

Embodiment 2

[0044] The difference from Example 1 is that, as image 3 As shown, in this embodiment, the metal pipe cap has a circular receiving window facing the receiving direction, and an infrared filter matching the size of the receiving window is fixedly installed at the receiving window.

[0045] In addition, one end of the pin is riveted on the substrate, and the other end of the pin is used as the pin of the product of this embodiment, image 3 The pins shown in are also 3.

[0046] Further, three or more clamping points 10 are provided on the metal tube cap for guiding and positioning the loading of the substrate, and when the clamping points are in contact with the solder pads on the substrate, the metal tube cap can electrical connection, so as to realize the grounding connection of the metal tube cap, and at the same time, it can also ensure that the distance between the sensitive element installed on the substrate and the infrared filter meets the design requirements, and pla...

Embodiment 3

[0050] The difference from Example 1 and Example 2 is that, as Figure 4 As shown, in this embodiment, two positioning columns 11 are provided on the inner wall of the metal pipe cap, and the positioning columns are used as both an installation positioning structure and a grounding connection structure. Conduction and heat conduction, one end of the two positioning posts are installed on the substrate, and connected with the substrate through conductive glue; the other ends of the two positioning posts are supported on the inner bottom surface of the metal tube cap, and connected to the bottom surface of the metal tube cap The electrical connection is realized through conductive glue connection or direct contact; the positioning post can also be directly connected to the ground wire on the substrate to realize electrical connection, and is used to realize the grounding of the metal pipe cap. By adjusting the height of the positioning column, the distance between the sensitive ...

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Abstract

The invention belongs to the technical field of sensors, and particularly relates to a packaging structure applied to an infrared sensor, and an infrared sensor packaging method. The packaging structure comprises a substrate, a sensitive element, a sensitive element matching circuit, a metal tube cap, a pin and a packaging adhesive, wherein the metal tube cap is provided with a receiving window, the receiving window is provided with an infrared optical filter, the sensitive element and the sensitive element matching circuit are electrically connected with the substrate, one end of the pin is fixedly installed on the substrate and electrically connected with the substrate, the other end of the pin extends out of the packaging adhesive and serves as an outer pin, the metal tube cap is also provided with a structure for realizing the positioning of the sensitive element, ensuring the distance between the sensitive element and the receiving window and realizing the grounding of the metal tube cap, one surface of the substrate, which is provided with the sensitive element, faces the receiving window, and the other surface of the substrate and the metal tube cap enclose a cavity which isfilled with packaging glue. According to the invention, the packaging structure and the production process of the infrared sensor are simplified, so that the product has the characteristics of simplestructure and low cost.

Description

technical field [0001] The invention belongs to the technical field of sensors, and in particular relates to a packaging structure applied to an infrared sensor and a packaging method for an infrared sensor. Background technique [0002] Infrared sensors realize the perception of the radiation source itself by receiving the energy of the infrared radiation source. Common infrared sensors include pyroelectric sensors, thermopile sensors, and infrared imaging sensors. [0003] Such as figure 1 As shown, the packaging structure of traditional infrared sensors includes: [0004] There is a metal cap 1 with a receiving window, and an infrared filter 4 is installed at the receiving window to realize the spectral selection of incident infrared rays; [0005] The sensitive element 7, the supporting circuit 8 of the sensitive element, etc. are installed on the substrate 5, and are electrically connected with the metal wire laid on the substrate to form a complete sensing circuit; ...

Claims

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Application Information

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IPC IPC(8): H01L37/02H01L25/16H01L21/54H01L21/52G01J1/42
CPCH01L25/165H01L21/54H01L21/52G01J1/42H10N15/10
Inventor 王园园
Owner 杭州敏和光电子技术有限公司
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