Packaging structure applied to infrared sensor, and infrared sensor packaging method

An infrared sensor and packaging structure technology, applied in the field of sensors, can solve the problems of high assembly process requirements, high cost, and complex structure, and achieve the effects of simplifying the packaging structure and packaging production process, simple structure, and realizing fixation and protection

Pending Publication Date: 2021-02-26

杭州敏和光电子技术有限公司

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AI-Extracted Technical Summary

Problems solved by technology

[0011] The purpose of the present invention is to overcome the problems of many components, complex structure, high assembly process requirements and high cost in the traditional infrared sensor pa...

Method used

A kind of packaging structure applied to infrared sensors provided by the present embodiment saves metal sockets, and is used for loading sensitive elements and sensitive element supporting circuits. Inside the tube cap, the production process is greatly simplified, so that the product has the advantages of simple structure, low cost and easy promotion.

A kind of packaging structure applied to infrared sensors provided by the present embodiment saves the metal socket, and is used for loading the substrate of the sensitive element and the supporting circuit of the sensitive element to install and be encapsulated in the metal with the boss by the encapsulant Inside the tube cap, the production process is greatly simplified, so that the product has the advantages of simple structure, low cost and easy promotion.

Further, metal pipe cap inner wall is also provided with boss 9, both used as the positioning structure of the sensitive element that realizes infrared sensor is also used as metal pipe cap ground connection structure, and described boss is annular, and substrate installation On the boss, to ensure that the distance between the sensitive element installed on the substrate and the infrared filter meets the design requirements, adjusting the position of the boss can realize the adjustment of the distance between the sensitive element and the receiving window; the boss is connected to the substrate through conductive glue. The ground wire is electrically connected to realize the grounding of the metal pipe cap, which is used to protect electromagnetic interference signals; the boss can also directly contact the ground wire on the substrate to realize electrical connection, and is used to realize the grounding of the metal pipe cap .

Further, three or more stuck points 10 are provided on the metal pipe cap, which are used to guide and position the loading of the substrate, and the stuck point can be realized when it is in contact with the bonding pad on the substrate. The electrical connection of the metal tube cap realizes the grounding connection of the metal tube cap, and at the same time, it can also ensure that the distance between the sensitive element installed on the substrate and the infrared filter meets the design requirements, and plays a protective role against electromagnetic interference signals; The clamping point can also be electrically connected to the substrate through conductive glue, thereby improving the reliability of the grounding of the metal pipe cap. In addition, adjusting the card point position can realize the adjustment of the distance between the ...

Abstract

The invention belongs to the technical field of sensors, and particularly relates to a packaging structure applied to an infrared sensor, and an infrared sensor packaging method. The packaging structure comprises a substrate, a sensitive element, a sensitive element matching circuit, a metal tube cap, a pin and a packaging adhesive, wherein the metal tube cap is provided with a receiving window, the receiving window is provided with an infrared optical filter, the sensitive element and the sensitive element matching circuit are electrically connected with the substrate, one end of the pin is fixedly installed on the substrate and electrically connected with the substrate, the other end of the pin extends out of the packaging adhesive and serves as an outer pin, the metal tube cap is also provided with a structure for realizing the positioning of the sensitive element, ensuring the distance between the sensitive element and the receiving window and realizing the grounding of the metal tube cap, one surface of the substrate, which is provided with the sensitive element, faces the receiving window, and the other surface of the substrate and the metal tube cap enclose a cavity which isfilled with packaging glue. According to the invention, the packaging structure and the production process of the infrared sensor are simplified, so that the product has the characteristics of simplestructure and low cost.

Application Domain

Thermoelectric device with dielectric constant thermal changeSolid-state devices +3

Technology Topic

EngineeringLight filter +6

Image

Examples

Experimental program(3)

Example Embodiment

[0034]Example 1:

[0035]This embodiment can be applied to pyroelectric sensors, such asfigure 2 The shown packaging structure applied to infrared sensors includes a substrate 5, a sensitive element 7 and a sensitive element supporting circuit 8, a metal cap 1 and a pin 3 provided on the substrate; the side of the substrate is closely attached to the inner wall of the metal cap Close; The metal cap has a 4mm×3mm rectangular receiving window 13 facing the receiving direction, and an infrared filter 4 matching the size of the receiving window is fixedly installed at the receiving window.

[0036]A metal wire is laid on the substrate, and the sensitive element and the sensitive element supporting circuit are electrically connected to the substrate through the metal wire and conductive glue to form a sensor circuit; one end of the pin is fixedly mounted on the substrate and passes The conductive glue 12 is electrically connected to the pad on the substrate, and the other end of the pin is used as the outer pin of the product of this embodiment,figure 2 There are 3 pins shown in the figure.

[0037]Specifically, the metal wire scheme on the substrate is configured according to the requirements of the sensor circuit; if the sensitive component supporting circuit is a chip, it will use metal wires (gold wire, silver wire, aluminum wire, alloy wire, copper wire, etc.) to connect to the chip If the sensitive component supporting circuit is a packaged chip, use conductive glue, such as solder paste, to connect to the substrate.

[0038]Further, a boss 9 is also provided on the inner side wall of the metal pipe cap, which is used to realize the positioning structure of the sensitive element of the infrared sensor and also serves as the ground connection structure of the metal pipe cap. The boss is ring-shaped, and the substrate is mounted on the boss To ensure that the distance between the sensitive component mounted on the substrate and the infrared filter meets the design requirements. Adjusting the position of the boss can adjust the distance between the sensitive component and the receiving window; the boss is connected to the ground on the substrate through conductive glue The electrical connection realizes the grounding of the metal pipe cap, which is used to protect electromagnetic interference signals and the like; the boss can also directly contact the ground wire on the substrate to realize electrical connection, and is used to realize the grounding of the metal pipe cap.

[0039]Further, one side of the substrate on which the sensitive element and the sensitive element supporting circuit are mounted faces the receiving window, and the other side of the substrate is enclosed with the metal tube cap to form a closed cavity at the bottom, and the cavity is filled with a package for fixing and protecting the substrate Glue 6: The pouring height of the packaging glue does not exceed the edge of the metal pipe cap, which can ensure the flatness of the bottom surface of the product of the present invention.

[0040]In addition, the infrared filter is determined according to the radiation wavelength and bandwidth required by the infrared sensor.

[0041]In this embodiment, the infrared filter adopts the long-wave pass silicon-based filter LWP5.0, the substrate adopts the PCB packaging substrate, and the packaging glue adopts the packaging vinyl; the PCB packaging substrate and the packaging vinyl have good thermal conductivity, The use of packaging glue with good thermal conductivity can form a good thermal conductivity with the substrate and the metal cap and maintain the stability of the environment in the packaging structure.

[0042]This embodiment provides a packaging structure applied to an infrared sensor, which saves a metal tube socket, and is used for mounting sensitive components and a substrate of a sensitive component supporting circuit, and is encapsulated in a metal tube cap with a boss by packaging glue , Greatly simplifies the production process, so that the product has the advantages of simple structure, low cost and easy promotion.

Example Embodiment

[0043]Example 2:

[0044]The difference from Example 1 is thatimage 3 As shown, in this embodiment, the metal pipe cap has a circular receiving window facing the receiving direction, and an infrared filter matching the size of the receiving window is fixedly installed at the receiving window.

[0045]In addition, one end of the pin is riveted on the substrate, and the other end of the pin is used as the pin of the product of this embodiment.image 3 There are also 3 pins shown in.

[0046]Further, three or more clamping points 10 are provided on the metal pipe cap, which are used to guide and position the loading of the substrate, and the clamping points can realize the metal pipe cap when they are in contact with the land on the substrate. The electrical connection of the metal pipe cap is realized, and the distance between the sensitive element and the infrared filter mounted on the substrate can be ensured to meet the design requirements, and the electromagnetic interference signal can be protected; the card The dots can also be electrically connected to the substrate through conductive glue, thereby improving the reliability of the grounding of the metal cap. In addition, adjusting the card point position can adjust the distance between the sensitive element and the receiving window.

[0047]In this embodiment, the infrared filter adopts the long-wave pass silicon-based filter LWP5.5, the substrate adopts an alumina ceramic substrate, and the packaging glue adopts packaging black glue.

[0048]This embodiment provides a packaging structure applied to infrared sensors, which saves metal pipe sockets, and is used for mounting sensitive components and substrates of sensitive component supporting circuits, and is encapsulated in a metal pipe cap with a clamping point structure by packaging glue , Greatly simplifies the production process, so that the product has the advantages of simple structure, low cost and easy promotion.

Example Embodiment

[0049]Example 3:

[0050]The difference from Example 1 and Example 2 is thatFigure 4As shown, in this embodiment, two positioning posts 11 are provided on the inner side wall of the metal pipe cap. The positioning posts are used as both the installation and positioning structure and the ground connection structure. The positioning posts are made of metal material, which is Both ends of the two positioning posts are installed on the substrate and connected with the substrate through conductive glue; the other ends of the two positioning posts are supported on the inner bottom surface of the metal pipe cap and are connected to the bottom surface of the metal pipe cap. The electrical connection is achieved through conductive glue connection or direct contact; the positioning column can also directly contact the ground wire on the substrate to achieve electrical connection, and is used to realize the grounding of the metal pipe cap. By adjusting the height of the positioning column, the distance between the sensitive element installed on the substrate and the infrared filter can be adjusted, thereby realizing the positioning of the substrate.

[0051]In addition, in this embodiment, one end of the pin is riveted on the substrate, and the other end of the pin is used as the pin of the product of this embodiment; the metal cap has a 4mm×3mm rectangle in the receiving direction. The receiving window is fixedly installed with an infrared filter matching the size of the receiving window.

[0052]The metal pipe cap with the positioning column structure in this embodiment can be used to install the positioning structure as well as the ground connection structure, and the distance between the sensitive element and the infrared filter can be flexibly adjusted by adjusting the height of the positioning column. The structure is simple. Easy to apply.

[0053]Based on Embodiment 1, the infrared sensor packaging method applied to the packaging structure of the infrared sensor in the present invention includes the following steps:

[0054]S1: Assemble the sensitive components and the supporting circuit of the sensitive components on the substrate;

[0055]S2, fixing one end of the pin on the substrate, and electrically connecting with the substrate through conductive glue or direct contact;

[0056]S3. After inserting and fixing the infrared filter at the receiving window on the metal tube cap, the substrate is installed in the metal tube cap, and positioning is done by relying on the special structure in the metal tube cap to ensure that the sensitive components and the receiving window The distance between them, the special structure is a boss;

[0057]S4, the metal pipe cap is directly contacted with the ground wire on the substrate to achieve grounding, or the metal pipe cap is electrically connected to the ground wire on the substrate by using conductive glue, thereby achieving grounding;

[0058]S5: Fill the sealed cavity at the bottom enclosed by the substrate and the metal tube cap with encapsulating glue for filling to realize the fixed protection of the substrate; at the same time, the other end of the pin extends out of the encapsulating glue and serves as an outer pin;

[0059]S6, heating and curing the packaging glue, and the packaging is completed after the packaging glue is cured.

[0060]For Embodiment 2 and Embodiment 3, it is only necessary to replace the boss structure in step S3 of the above method with the corresponding card point structure or positioning column structure respectively to complete the corresponding infrared sensor packaging method.

[0061]In summary, the present invention no longer uses metal sockets, but uses packaging glue to encapsulate the substrate in the metal tube cap to realize the fixation and protection of the substrate, the positioning of the distance between the sensitive element and the receiving window, and the The electromagnetic shielding of the sensitive component supporting circuit greatly simplifies the packaging structure of the infrared sensor and the packaging production process of the infrared sensor, so that the product has the advantages of simple structure, low cost and easy promotion.

PUM

Description & Claims & Application Information

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Packaging structure applied to infrared sensor, and infrared sensor packaging method

AI-Extracted Technical Summary

Problems solved by technology

Method used

Abstract

Image

Examples

Example Embodiment

Example Embodiment

Example Embodiment

PUM

Description & Claims & Application Information

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