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Plasma processing apparatus having a focus ring adjustment assembly

A technology for processing equipment and focusing rings, which is applied in the fields of electrical components, manufacturing tools, semiconductor/solid-state device manufacturing, etc.

Active Publication Date: 2021-03-09
베이징이타운세미컨덕터테크놀로지컴퍼니리미티드 +1
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In some cases this may require physical replacement of certain components in the processing system

Method used

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  • Plasma processing apparatus having a focus ring adjustment assembly
  • Plasma processing apparatus having a focus ring adjustment assembly
  • Plasma processing apparatus having a focus ring adjustment assembly

Examples

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Embodiment Construction

[0035] Reference will now be made in detail to embodiments, one or more examples of which are illustrated in the drawings. Each example is provided by way of illustration of an embodiment, not limitation of the disclosure. In fact, it will be apparent to those skilled in the art that various modifications and changes can be made in the embodiments without departing from the scope or spirit of the present disclosure. For example, features illustrated or described as part of one embodiment can be used with another embodiment to yield a still further embodiment. Thus, it is intended that aspects of the present disclosure cover such modifications and variations.

[0036] Exemplary aspects of the present disclosure relate to systems and methods for automatically replacing replaceable components in semiconductor workpiece processing equipment. The systems and methods may provide for manipulation of replaceable components through vacuum equipment. Exemplary replaceable parts may i...

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Abstract

A plasma processing apparatus is provided. The plasma processing apparatus includes a processing chamber defining a vertical direction and a lateral direction. The plasma processing apparatus includesa pedestal disposed within the processing chamber. The pedestal is configured to support the substrate. The plasma processing apparatus includes a radio frequency (RF) disposed within the processingchamber. The RF bias electrode defines a RF zone extending between a first end of the RF bias electrode and a second end of the RF bias electrode along the lateral direction. The plasma processing apparatus includes a focus ring disposed within the processing chamber. The plasma processing apparatus further includes a focus ring adjustment assembly. The focus ring adjustment assembly includes a lift pin positioned outside of the RF zone. The lift pin is movable along the vertical direction to adjust a distance between the pedestal and the focus ring along the vertical direction.

Description

[0001] priority claim [0002] This application claims the serial number of the U.S. Provisional Application entitled "SYSTEMS AND METHODS FOR TRANSPORTATION OF REPLACEABLE PARTS INA VACUUM PROCESSING APPARATUS," filed May 14, 2019 62 / 847,595, which application is hereby incorporated by reference. technical field [0003] The present disclosure relates generally to processing workpieces, and more particularly to focus ring adjustment assemblies for systems for processing workpieces, such as semiconductor workpieces, under vacuum. Background technique [0004] Processing systems that expose workpieces (e.g., semiconductor wafers or other suitable substrates) to an overall processing scheme for forming semiconductor devices or other devices may perform multiple processing steps, such as plasma processing (e.g., lift-off, etch, etc. ), heat treatment (eg, annealing), deposition (eg, chemical vapor deposition), etc. To perform these processing steps, the system may include one...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01J37/32
CPCH01J37/32642H01J37/32082H01J37/32807H01J37/3288H01J37/32743H01J37/32733H01J37/32715H01J37/32568H01J37/32899H01J37/321H01L21/67184H01L21/68707H01L21/68742H01J37/32541H01J37/32174H01L21/67201H01L21/6831H01L21/68785H01L21/67745H01L21/67766H01L21/681B25J11/0095B25J15/0014H01L21/67742H01J2237/2007H01J2237/334H01L21/67069H01L21/67167H01L21/67196H01L21/02365
Inventor 马丁·L·朱克P·J·伦贝西斯T·特维斯瑞安·帕库尔斯基马绍铭杨晓晅
Owner 베이징이타운세미컨덕터테크놀로지컴퍼니리미티드
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