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Method and system for supporting pledge splitting financing

A pledge and pledge technology, applied in the field of supporting pledge split financing, can solve the problems of high accumulated pledge value of pledge and inseparability of pledge.

Pending Publication Date: 2021-03-23
CHINA CITIC BANK
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The embodiment of this application provides a method and system that supports the split financing of pledges, which solves the problem that under the existing technical conditions, the pledges cannot be split when the debtor is financing, and the accumulated pledge value of the pledges is often much higher than the financing amount. It has achieved the technical effect that the system dynamically splits the value of the pledge according to the debtor's financing amount and the pledge used for guarantee

Method used

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  • Method and system for supporting pledge splitting financing
  • Method and system for supporting pledge splitting financing
  • Method and system for supporting pledge splitting financing

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Embodiment 1

[0023] Such as figure 1 As shown, the embodiment of this application provides a method for supporting collateral split financing, wherein the method further includes:

[0024] Step S100: obtaining the first financing application information;

[0025] Specifically, the so-called financing refers to a business activity in which enterprises use various methods to raise funds from financial institutions or financial intermediaries. The first financing application information is the financing fund that the debtor applies to the financial institution for a certain project or other reasons, and pledges the financial movable property to the relevant financial institution as collateral.

[0026] Step S200: Obtain financing amount information according to the first financing application information;

[0027] Specifically, the financing amount information is the specific amount of funds that the debtor applies for financing from the financial institution, and the applied financing amou...

Embodiment 2

[0060] Based on the same inventive idea as the method for supporting split financing of pledges in the foregoing embodiments, the present invention also provides a system for supporting split financing of pledges, such as figure 2 As shown, the system includes:

[0061] The first obtaining unit 11: the first obtaining unit 11 is used to obtain the first financing application information;

[0062] The second obtaining unit 12: the second obtaining unit 12 is configured to obtain financing amount information according to the first financing application information;

[0063] The third obtaining unit 13: the third obtaining unit 13 is used to obtain pledge information;

[0064] The fourth obtaining unit 14: the fourth obtaining unit 14 is used to obtain the accumulated value information of the pledge according to the pledge information;

[0065] The first judging unit 15: the first judging unit 15 is used to judge whether the accumulated value information of the pledge is great...

Embodiment 3

[0085] Refer below image 3 An electronic device according to an embodiment of the present application will be described.

[0086] image 3 A schematic structural diagram of an electronic device according to an embodiment of the present application is shown.

[0087] Based on the inventive idea of ​​a method for supporting collateral split financing in the foregoing embodiments, the present invention also provides a system for supporting collateral split financing, on which a computer program is stored, and when the program is executed by a processor, it realizes Steps in any method of a method for supporting collateral split financing described above.

[0088] Among them, in image 3 In, bus architecture (represented by bus 300), bus 300 may include any number of interconnected buses and bridges, bus 300 will include one or more processors represented by processor 302 and various types of memory represented by memory 304 circuits linked together. The bus 300 may also lin...

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Abstract

The invention discloses a method and a system for supporting pledge splitting financing. The method comprises the steps: obtaining first financing application information; obtaining financing amount information according to the first financing application information; obtaining pledge information; obtaining accumulated value information of the pledge according to the pledge information; judging whether the pledge accumulated value information is greater than the financing amount information or not; if the pledge accumulated value information is greater than the financing amount information, obtaining first splitting information; and splitting the pledge accumulated value information into first value information and second value information according to the first splitting information, thefirst value information being used for pledge and the second value information being not used for pledge. The problem that in the prior art, the pledge cannot be split when a debtor finances, and theaccumulated pledge value of the pledge is far higher than the financing amount often occurs is solved.

Description

technical field [0001] The present invention relates to the field of pledge financing, in particular to a method and system for supporting pledge split financing. Background technique [0002] In the movable property pledge financing business of supply chain finance, the debtor pledges the movable property to the financial institution to obtain financing funds. A financing usually requires multiple pledges for guarantee. Everything is complete and indivisible. [0003] However, in the process of realizing the technical solution of the invention in the embodiment of the present application, the inventor of the present application found that the above-mentioned technology has at least the following technical problems: [0004] Under the background of the existing technology, the pledges used for financing guarantees are complete and inseparable, and there are often scenarios where the accumulated pledge value of the pledges is much higher than the financing amount. Contents...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06Q40/02G06Q40/06G06Q40/04
CPCG06Q40/02G06Q40/04G06Q40/06
Inventor 刘彦君刘永生孔祥宁方军朱江周荃
Owner CHINA CITIC BANK