PCB surface treatment metal thin layer quality analysis method

Abstract

The invention discloses a PCB surface treatment metal thin layer quality analysis method. The method comprises the following steps that: scissors and an automatic sampling machine are used for takingout an area needing to be measured from a PCB; metal spraying treatment is performed; a test sample is firmly fixed on a metal sample table, and then mounting the sample table on the inclined surfaceof a test platform; a first protective layer is deposited by using electron beams; after the electron beam deposition is completed, a second protective layer is deposited by using a focused ion beam;the inclination angle of the measuring platform is adjusted, so that the surface of the sample can be cut in a manner that the surface of the sample is perpendicular to the direction of the focused ion beam; and the inclination angle of the sample is adjusted, and observation is performed. According to the method of the invention, a double-beam scanning electron microscope is used for processing and testing a sample, so that the influence of contact with chemical solution , mechanical stress, impurity pollution and the like in the sample preparation process can be avoided; by optimizing the test angle of the double-beam scanning electron microscope, an effect close to a plane test effect can be achieved, so that an accurate measurement result can be obtained; and therefore, a series of tests can be completed quickly.

Description

technical field [0001] The invention relates to the technical field of PCB surface treatment, in particular to a quality analysis method for a PCB surface treatment metal thin layer. Background technique [0002] With the continuous improvement of science and technology and the continuous upgrading of electronic products, PCB is required to develop in the direction of "high, precise and sharp". Coatings such as tin plating and gold fingering tend to become thinner and thinner, so new requirements are put forward for analyzing the quality of these coatings. [0003] Existing coating quality analysis methods: the current analysis methods are mainly through electroplating or chemical deposition of a layer of nickel (generally greater than 3 μm) or protection of the surface treatment layer, and then making vertical slices, and then the obtained slices are subjected to steps such as grinding and polishing to obtain Qualified vertical slices, and then use the scanning electron mi...

AI Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is to provide a method for analyzing the quality of a PCB surface-treated metal thin layer, which is equipped with a double-beam scanning electron microscope for processing and testing the sample, which can avoid the influence of contact with chemical solutions, mechanical stress, and impurity pollution during the sample preparation process. The optimization of the test angle of the double-beam scanning electron microscope can achieve a nearly flat test effect, so as to obtain accurate measurement results, so that a series of tests can be completed quickly, and the traditional analysis method is time-consuming, complicated and easy to cause Test Distortion Problems