PCB production method

A production method and technology for PCB boards, which are applied in the removal of conductive materials by chemical/electrolytic methods, secondary processing of printed circuits, electrical components, etc., can solve problems such as surface accuracy reduction, defective products, damage, etc. The effect of improving accuracy, reducing the probability of defective products, and reasonable production methods

Inactive Publication Date: 2021-04-02
湖北碧辰科技股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The purpose of the present invention is to provide a PCB board production method to solve the current existing PCB board production process proposed in the above background technology. After the material is confirmed, it is necessary to carry out surface drilling, and this process is affected by the strength of the board itself. , it is very easy to be damaged, and the safety of the PCB board processing process cannot be guaranteed, and after grinding and then combined with the corrosive liquid for processing, the corroded surface is prone to decrease in precision, which affects the production effect of the PCB board. The problem of increased probability of defective products

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0029] A method for producing a PCB, the method steps are as follows:

[0030] Step 1: Material confirmation: Material selection is required. After receiving the final requirements provided by the customer, professional engineering personnel will sort out the requirements in detail, and make a product PPT to provide to the customer for review;

[0031] Step 2: Print out the drawn circuit board with transfer paper, choose the circuit board with the best printing effect, use the photosensitive plate to make the whole process diagram of the circuit board, and cut the circuit board with copper film on both sides. According to the size of the circuit board, use fine sandpaper to polish off the oxide layer on the surface of the copper clad laminate to ensure that the toner on the thermal transfer paper can be firmly printed on the copper clad laminate when the circuit board is transferred. Bright surface, no obvious stains;

[0032] Step 3: Check whether the transfer of the circuit...

Embodiment 2

[0039] A method for producing a PCB, the method steps are as follows:

[0040] Step 1: Material confirmation: Material selection is required. After receiving the final requirements provided by the customer, professional engineering personnel will sort out the requirements in detail, and make a product PPT to provide to the customer for review;

[0041] Step 2: Print out the drawn circuit board with transfer paper, choose the circuit board with the best printing effect, use the photosensitive plate to make the whole process diagram of the circuit board, and cut the circuit board with copper film on both sides. According to the size of the circuit board, use fine sandpaper to polish off the oxide layer on the surface of the copper clad laminate to ensure that the toner on the thermal transfer paper can be firmly printed on the copper clad laminate when the circuit board is transferred. Bright surface, no obvious stains;

[0042] Step 3: Check whether the transfer of the circuit...

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PUM

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Abstract

The invention discloses a PCB production method in the technical field of production methods. The method comprises the following steps: 1, carrying out material confirmation, wherein a material is selected, a professional engineer carries out detailed carding on requirements after the final requirements provided by a customer are received, and a product PPT is manufactured, and is provided for thecustomer for reexamination; and 2, printing a drawn circuit board with transfer paper, selecting a manufacturing circuit board with the best printing effect, manufacturing the circuit board with a photosensitive plate in a whole-course diagram, coating copper films on two sides of the circuit board, and cutting a copper-clad plate into the size of the circuit board. According to the PCB production method, in the drilling link after material confirmation, the bottom plate can be preset, the safety of the PCB machining process is guaranteed, corrosive liquid is prepared, pre-machining is conducted, then fine sandpaper polishing is conducted in a matched mode, the line processing precision after corrosion is improved, the production method is more reasonable, the production effect of the PCBis improved, and the probability of defective products is reduced.

Description

technical field [0001] The invention discloses a method for producing a PCB board, and specifically belongs to the technical field of production methods. Background technique [0002] PCB board, also known as printed circuit board, is a provider of electrical connections for electronic components. Its design is mainly layout design; the main advantage of using circuit boards is to greatly reduce wiring and assembly errors, improve automation level and production labor rate, According to the number of layers of circuit boards, it can be divided into single-sided boards, double-sided boards, four-layer boards, six-layer boards and other multi-layer circuit boards. [0003] The single-sided board is on the most basic PCB, the parts are concentrated on one side, and the wires are concentrated on the other side. The double-sided board has wiring on both sides, but to use the wires on both sides, there must be a proper circuit connection between the two sides. The multilayer boar...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/00H05K3/06H05K3/26
CPCH05K3/0047H05K3/06H05K3/067H05K3/26
Inventor 阮甲鹏张扬朱琪
Owner 湖北碧辰科技股份有限公司
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