FPC hole plating method

Abstract

The invention relates to a flexible printed circuit (FPC) hole plating method, which comprises the following steps of: S10, after drilling a hole on a double-sided substrate FCCL, performing PTH treatment so as to deposit a thin copper layer on a copper surface and a hole wall; S20, pasting a dry film on one surface of the FCCL; S30, performing standing for preset time, then directly entering a developing section, and enabling a developing liquid medicine to react with the dry film to form a uniform annular dry-film-free area taking the hole as the center; S40, entering a washing section to clean after the developing section, cleaning the dissolved dry film, and then entering a drying section to dry the product; S50, exposing the whole surface of the dry film after drying, and tearing off a protective film of the dry film; S60, pasting a dry film on one surface, which is not pasted with the dry film, of the FCCL, and then repeating the S30, S40 and S50; and S70, thickening the hole copper through electroplating copper to enable the hole copper to reach the required thickness. By the adoption of the method, alignment is not needed, the skill requirement for manual alignment is reduced, meanwhile, the precision can reach the extremely high level, and the actual measurement precision reaches + / -10 micrometers.

Description

technical field [0001] The invention relates to the technical field of FPC, in particular to a FPC hole plating method. Background technique [0002] Electronic products, especially consumer electronic products, have been developing in the direction of light weight and miniaturization in recent years. As a component of electronic products - circuit boards, due to the same requirements, the requirements for circuit density are getting higher and higher. This requires more lines to be arranged per unit area, so the line width / line spacing of the circuit board is also required to be smaller. [0003] The production of thinner line width / line spacing needs to match the thinner copper layer, and the double-sided / multi-layer board needs to metallize the via hole, and the thickness of the metal layer in the hole must meet the corresponding requirements to ensure conduction The reliability of the performance of the hole, in theory, the thicker the thickness, the higher the reliabi...

AI Technical Summary

Problems solved by technology

[0005] However, this process also has some problems, such as the difficulty of alignment, once the alignment has a large deviation during the plating hole, it is easy to cause hidden dangers such as circuit short circuit in the subsequent circuit production

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