Method and device for removing defects of photomask
A photomask and defect technology, applied in the field of photomask defect removal methods and devices, can solve the problems of defective material splashing, occupying machines, and product scrapping, etc.
Pending Publication Date: 2021-05-07
泉芯集成电路制造(济南)有限公司
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Problems solved by technology
However, when the defect area is large and its material is thick, it is easy to splash the defect material when directly using high-energy laser to destroy the defect, and then form secondary defects on the mask, which takes longer to remove the spatter The secondary defect that takes too long not only wastes manpower and material resources, but also takes up the machine and delays the delivery time; and if the spatter is too serious and consumes too much time, manpower and material resources, there is no need to repair the mask. will cause the product to be scrapped
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[0033] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.
[0034] As mentioned in the background, in the production process of the photomask, it is very important to repair the defects formed on the photomask. One of the methods for removing the defects is to use a laser. However, when the defect area is large and its material is thick, it is easy to splash the defect material when directly using high-energy laser to destroy the defect, and then form secondary defects on the mask, which takes longer to remove the spatt...
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The invention discloses a method and a device for removing defects of a photomask. The method comprises the steps of: providing a to-be-processed photomask which comprises a transparent substrate and a shading defect layer located on the surface of one side of the transparent substrate; thinning the shading defect layer by adopting first laser from one side, deviating from the transparent substrate, of the shading defect layer; and adopting second laser to remove the thinned shading defect layer, wherein the laser pulse energy of the second laser is larger than that of the first laser. Firstly, the first laser with low laser pulse energy is selected for thinning the shading defect layer, and then the second laser with high laser pulse energy is used for thoroughly removing the thinned shading defect layer; furthermore, when the second laser is adopted to remove the thinner shading defect layer, the splashing degree can be reduced, the condition of secondary defects caused when the shading defect layer is removed is improved, and high defect removal efficiency is ensured.
Description
technical field [0001] The invention relates to the technical field of semiconductors, and more specifically, to a method and device for removing defects of a photomask. Background technique [0002] In the photomask production process, it is very important to repair the defects formed on the photomask. One of the methods to remove the defects is to use a laser. However, when the defect area is large and its material is thick, it is easy to splash the defect material when directly using high-energy laser to destroy the defect, and then form secondary defects on the mask, which takes longer to remove the spatter The secondary defect that takes too long not only wastes manpower and material resources, but also takes up the machine and delays the delivery time; and if the spatter is too serious and consumes too much time, manpower and material resources, there is no need to repair the mask. It will cause the product to be scrapped. Therefore, how to reduce the spatter during ...
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Login to View More IPC IPC(8): G03F1/72
CPCG03F1/72
Inventor 朱佳楠贺遵火张哲玮高翌
Owner 泉芯集成电路制造(济南)有限公司