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Resin sheet fixing device

A technology of fixing device and resin sheet, which is applied in the fields of electric solid-state device, semiconductor/solid-state device manufacturing, semiconductor device, etc., can solve the problems of time-consuming wafer handling, difficulty in miniaturization, and poor thickness accuracy of resin sheet, etc.

Pending Publication Date: 2021-05-07
DISCO CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] In this way, the processing device of the prior art has two tables and a conveying mechanism, so it is difficult to miniaturize
In addition, it takes time to transfer wafers
In addition, since the resin sheet softened by the heating stage solidifies after being transported to the cooling stage, the thickness accuracy of the resin sheet deteriorates.

Method used

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  • Resin sheet fixing device
  • Resin sheet fixing device
  • Resin sheet fixing device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0025] figure 1 The resin sheet fixing device 1 of the present embodiment shown fixes (forms) the resin sheet S held by the sheet holding surface 23 of the sheet holding unit 20 on one surface of the wafer W. As shown in FIG.

[0026] The resin sheet fixing device 1 has: a wafer holding unit 10 which holds the wafer W via the wafer holding surface 13 in the vacuum forming chamber 2; a sheet holding unit 20 which holds the resin sheet S via the sheet holding surface 23; Up and down movement mechanism (up and down action mechanism) 30 .

[0027] The vacuum forming chamber 2 is a casing of the resin sheet fixing device 1 capable of vacuuming the inside, and has an opening 4, a cover 3 capable of covering the opening 4, a cover opening and closing mechanism 5 for opening and closing the cover 3, and a cover opening and closing mechanism for opening and closing the opening 4. A vacuum pump 7 for vacuuming the inside of the vacuum forming chamber 2 .

[0028] Wafer holding unit 10...

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PUM

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Abstract

The invention provides a resin sheet fixing device. The resin sheet fixing device is miniaturized. A sheet holding unit of the resin sheet fixing device includes: a Peltier element parallel to a sheet holding surface of a sheet holding table and having an upper surface close to the sheet holding surface and a lower surface away from the sheet holding surface; a DC power supply that supplies a DC current to the Peltier element; and a switch that switches the direction of the direct current supplied to the Peltier element. The current in the first direction flows through the Peltier element, thereby softening the resin sheet and thermally bonding the resin sheet to a wafer, and the switch is switched, thereby causing the current in the second direction to flow through the Peltier element, thereby hardening the resin sheet held by the sheet holding surface and fixing the resin sheet to one surface of the wafer.

Description

technical field [0001] The present invention relates to a resin sheet fixing device. Background technique [0002] It is known that wafers of devices are respectively formed in regions divided by a plurality of intersecting dividing lines. The wafer is divided along planned dividing lines to obtain chips. In this dividing process, in order to suppress scattering of chips accompanying dividing, a tape is attached to one surface of the wafer as disclosed in Patent Document 1, for example. [0003] In this technique, after singulation processing, the chips are picked from the tape. At this time, the tape paste may adhere to the chip. As a countermeasure against this, in the technique disclosed in Patent Document 2, a polyolefin-based resin sheet is heated to be thermally welded to one surface of a wafer, and then cooled to be solidified. Such a resin sheet becomes a substitute for a belt. In this technique, after singulation processing, chips are picked up from a resin she...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/683
CPCH01L21/6835H01L2221/68327H01L2221/68381H01L21/67132H01L21/67103H01L21/67109H01L21/6836
Inventor 斋藤良信
Owner DISCO CORP