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Solder paste printing machine for flexible PCB

A technique for solder paste printing machines and PCB boards, applied in printing machines, rotary printing machines, screen printing machines, etc., can solve the problems of poor printing effect of flexible PCB boards and achieve good printing effects

Pending Publication Date: 2021-05-14
深圳市恒鑫晟电子设备有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, the existing solder paste printers do not print well on flexible PCBs.

Method used

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  • Solder paste printing machine for flexible PCB
  • Solder paste printing machine for flexible PCB
  • Solder paste printing machine for flexible PCB

Examples

Experimental program
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Embodiment Construction

[0031] The present invention will be described in further detail below in conjunction with the accompanying drawings.

[0032] This specific embodiment is only an explanation of the present invention, and it is not a limitation of the present invention. Those skilled in the art can make modifications to this embodiment as required after reading this specification, but as long as they are within the rights of the present invention All claims are protected by patent law.

[0033] This embodiment relates to a solder paste printing machine for a flexible PCB, such as figure 1 and figure 2 As shown, it includes: an installation base plate 100, a control mechanism 200, and a correction platform 300, a tensioning mechanism 400, an alignment platform 500, a CCD mechanism 600, and a steel mesh set on the installation base plate 100 and electrically connected to the control mechanism 200. Lifting mechanism 700.

[0034]Specifically, the correction platform 300 is used to adjust the ...

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Abstract

The invention discloses a solder paste printing machine for a flexible PCB, and relates to the technical field of solder paste printing machines. The solder paste printing machine comprises a mounting bottom plate, a control mechanism, and a correction platform, a tensioning mechanism, an alignment platform, a CCD mechanism and a steel mesh lifting mechanism which are arranged on the mounting bottom plate and are electrically connected with the control mechanism, wherein the correcting platform is used for adjusting the position of a working platform located on the correcting platform, the tensioning mechanism is located at the input end of the correcting platform and used for tensioning the flexible PCB, the alignment platform is located at the output end of the correcting platform and used for tensioning the flexible PCB and pulling the flexible PCB to a designated position, the steel mesh lifting mechanism is located on one side of the correcting platform and used for controlling a steel mesh to print the flexible PCB located on the working platform, and the CCD mechanism is located on the other side of the correcting platform and used for detecting the printed flexible PCB. By the adoption of the solder paste printing machine, the advantage of being good in flexible PCB printing effect is achieved.

Description

technical field [0001] The invention relates to the technical field of solder paste printing machines, in particular to a solder paste printing machine for flexible PCB boards. Background technique [0002] Modern solder paste printing machines generally consist of mechanisms such as plate loading, solder paste addition, embossing, and circuit board delivery. Its working principle is: first fix the circuit board to be printed on the printing positioning table, and then use the left and right scrapers of the printing machine to print the solder paste or red glue on the corresponding pad through the steel mesh. The transfer table is input to the placement machine for automatic placement. [0003] However, the existing solder paste printers do not print well on flexible PCBs. Contents of the invention [0004] The purpose of the present invention is to provide a solder paste printing machine for flexible PCB boards in view of the defects and deficiencies of the prior art, w...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/34B41F15/08B41F15/14B41F13/008B41F15/36B41F33/00
CPCB41F13/008B41F15/08B41F15/14B41F15/36B41F33/00H05K3/3478
Inventor 郑时雷
Owner 深圳市恒鑫晟电子设备有限公司
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