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Super-thick double-sided adhesive tape technology without excessive adhesive and tool marks and flat-knife material feeding system thereof

A double-sided adhesive and knife mark technology, applied in the field of double-sided adhesive, can solve the problems of overflowing glue, difficult processing, knife marks on the bottom film, etc.

Active Publication Date: 2021-05-18
青岛盈科精密橡塑有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] At present, the thickness of the double-sided adhesive on the market is more than 0.05MM, generally there will be slight overflow of glue, the thickness of more than 0.1MM will cause serious glue overflow, and the thickness of more than 0.15MM is difficult to process, and the bottom film will have a knife in the processing process of the existing technology print

Method used

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  • Super-thick double-sided adhesive tape technology without excessive adhesive and tool marks and flat-knife material feeding system thereof
  • Super-thick double-sided adhesive tape technology without excessive adhesive and tool marks and flat-knife material feeding system thereof
  • Super-thick double-sided adhesive tape technology without excessive adhesive and tool marks and flat-knife material feeding system thereof

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Embodiment Construction

[0039] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention.

[0040] In describing the present invention, it should be understood that the terms "upper", "lower", "front", "rear", "left", "right", "top", "bottom", "inner", " The orientation or positional relationship indicated by "outside", etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the referred device or element must have a specific orientation, so as to Specific orientation configurations and operations, therefore, are not to be construed as limitations on the invention.

[0041] refer to figure 1...

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Abstract

The invention discloses a flat-knife material feeding system for a super-thick double-sided adhesive tape technology without excessive adhesive and tool marks. The flat-knife feeding system is characterized by comprising the following steps of S1, slitting by a circular knife; S2, laminating; S3, carrying out A die stamping; S4, carrying out B die stamping; S5, carrying out C die stamping; S6, carrying out D die stamping; S7, carrying out E die stamping; and S8, carrying out F die stamping. According to the flat-knife material feeding system for the super-thick double-sided adhesive tape technology without the excessive glue and the tool marks, cutting of release films in different processes is achieved through ABCDEF, namely, adhesive tape cutting is carried out by using transverse and vertical splicing in the cutting process, the product size precision is met by adopting a method of digging waste materials and reserving products, the problem of difficulty of excessive glue of the adhesive face of the double-sided adhesive tape is solved, meanwhile, the technical problem that upper and lower bottom films are free of tool marks is solved, the stripping effect of the products is improved, the waste materials are pulled away while the materials are fed through the material feeding system, and the continuity of production in all stages is guaranteed.

Description

technical field [0001] The invention relates to the technical field of double-sided adhesive tape, in particular to an ultra-thick double-sided adhesive tape without overflow glue and knife mark process and a flat knife feeding system thereof. Background technique [0002] At present, the thickness of the double-sided adhesive on the market is more than 0.05MM, generally there will be slight overflow of glue, the thickness of more than 0.1MM will cause serious glue overflow, and the thickness of more than 0.15MM is difficult to process, and the bottom film will have a knife in the processing process of the existing technology print. For this reason, we have designed an ultra-thick double-sided adhesive, no overflow glue, no knife marks process and its flat knife feeding system. Contents of the invention [0003] The object of the present invention is to solve the problems existing in the prior art, and propose an ultra-thick double-sided adhesive, glue-free and knife-mark...

Claims

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Application Information

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IPC IPC(8): B26D9/00B26D1/15B29C65/48B26F1/40B26F1/44B26D7/18
CPCB26D9/00B26D1/151B29C65/48B26F1/40B26F1/44B26D7/18
Inventor 陈涛欧阳宝旭
Owner 青岛盈科精密橡塑有限公司
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