Sensor

A sensor and sensor housing technology, applied in the field of sensors, can solve the problems of reduced sensor signal monitoring sensitivity, inability to control accurate positioning of circuit boards, and loose circuit boards.

Pending Publication Date: 2021-05-18
TANGZHI SCI & TECH HUNAN DEV CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, this fixing method cannot control the accurate positioning of the circuit board, and the circuit board is prone to loosening in a long-term vibration and shock environment, resulting in a decrease in the signal monitoring sensitivity of the sensor

Method used

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Embodiment Construction

[0035] In order to enable those skilled in the art to better understand the technical solutions in the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described The embodiments are only some of the embodiments of the present application, but not all of them.

[0036] It should be noted that when an element is referred to as being "fixed" or "disposed on" another element, it may be directly disposed on another element or indirectly disposed on another element; when an element is referred to as being "connected" It may be directly connected to another element or indirectly connected to another element.

[0037] It is to be understood that the terms "length", "width", "top", "bottom", "front", "rear", "left", "right", "vertical", "horizontal", "top" , "bottom", "inner", "outer" and other indicated...

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Abstract

The invention discloses sensor. A sensing element on a circuit board is used for sensing the physical quantity of a measured position and converting the physical quantity into an electric signal, a connecting cable penetrates through a central opening of a pressing sleeve to be connected with the circuit board and is transmitted to a rear-stage acquisition instrument through an electric connector, and the circuit board and the pressing sleeve are both arranged in an inner cavity of a sensor shell. The first end of the circuit board is inserted into the bottom of the sensor shell, the pressing sleeve can be connected with the inner wall of the sensor shell in an attached mode through the outer surface of the installation part, the end, away from the installation part, of the fixing part abuts against the second end of the circuit board, the circuit board can be axially pressed, and the outer diameter of the fixing part is smaller than that of the installation part, that is, a gap is reserved between the outer surface of the fixing part and the inner wall of the sensor shell, and when pouring sealant is poured into the inner cavity of the sensor shell, the filling area of the pouring sealant can be increased, so that the holding force between the pressing sleeve and the inner wall of the sensor shell is increased, the fixing effect of the circuit board is improved, and the signal monitoring sensitivity of the sensor is ensured.

Description

technical field [0001] The invention relates to the technical field of monitoring equipment, in particular to a sensor. Background technique [0002] As a monitoring device, the sensor is widely used in machinery, ships, rail transit and other fields. Among them, the circuit board is installed inside the sensor housing, and the physical quantities such as vibration, shock and temperature signals of the measured position are sensitive through the sensitive elements on the circuit board. , after converting it into an electrical signal, the signal is transmitted through the connecting cable. [0003] In the prior art, the circuit board is generally inserted into the sensor housing, the circuit board is fixed by pressing, and potting glue is poured into the sensor housing to achieve the effect of insulation and shock resistance. However, this fixing method cannot control the accurate positioning of the circuit board, and the circuit board is prone to loosening in a long-term vi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01D11/00G01D11/24G01D11/26G01D3/036G01H11/06
CPCG01D3/036G01D11/00G01D11/245G01D11/26G01H11/06
Inventor 邓柳靖王巍松施文钦李思华陈伟琪
Owner TANGZHI SCI & TECH HUNAN DEV CO LTD
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