Defect inspection method for sensor package structure
A package structure and defect detection technology, applied in the field of detection, can solve problems such as misjudgment of sensor package structure detection methods
Active Publication Date: 2021-06-01
TONG HSING ELECTRONICS IND LTD
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However, since the sensor package structure includes multiple surfaces in the height direction, and defects on any one surface may be imaged on other surfaces (that is, false defects are formed), which in turn causes the existing sensor package Structural detection methods produce false positives
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[0021] see Figure 1 to Figure 4 As shown, it is an embodiment of the present invention. This embodiment discloses a defect detection method of a sensor packaging structure, which is used to detect a sensor packaging structure 2 . In order to facilitate the description of the defect detection method of the sensor packaging structure of this embodiment, a detection device 1 is firstly described below, and the defect detection method of the sensor packaging structure is implemented through the detection device 1 in this embodiment. be implemented, but the present invention is not limited thereto.
[0022] Such as Figure 1 to Figure 3 As shown, the detection device 1 includes a carrier platform 11 , a transport device 12 , an image capture device 13 , a processor 14 , and a control device 15 . Wherein, the carrying platform 11 is used to provide a plurality of sensor packaging structures 2 disposed thereon, and the handling device 12 can move at least one of the plurality of ...
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A defect inspection method for a sensor package structure includes: using an image capture device to separately focus on and take pictures of at least three to-be-inspected regions of the sensor package structure along a height direction, so as to respectively obtain a defect image from one of the to-be-inspected regions, wherein the defect images are aligned with each other along the height direction and have different grayscale values; determining the defect image having a maximum grayscale value as a reference defect image, and defining any of the remaining defect images as a to-be-confirmed defect image; multiplying the maximum grayscale value by a predetermined grayscale ratio to obtain a predicted grayscale value, and confirming whether a difference between the to-be-confirmed and predicted grayscale values falls within an error range, so as to distinguish whether a plurality of defects which are positioned on the plurality of areas to be detected and are arranged along the height direction belong to false defects or real defects.
Description
technical field [0001] The invention relates to a detection method, in particular to a defect detection method of a sensor packaging structure. Background technique [0002] The existing detection method of the sensor package structure is to take a photo of a sensor package structure, and then confirm whether there is a defect (such as dust) from the photo corresponding to the sensor package structure. However, since the sensor package structure contains multiple surfaces in the height direction, and defects on any one surface may be imaged on other surfaces (that is, form false defects), which will lead to the existing sensor package Structural detection methods produce false positives. [0003] Therefore, the inventor believes that the above-mentioned defects can be improved, Naite devoted himself to research and combined with the application of scientific principles, and finally proposed an invention with reasonable design and effective improvement of the above-mentioned...
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IPC IPC(8): G06T7/00G01N21/01G01N21/88
CPCG06T7/0004G01N21/88G01N21/01G01N2021/0112G06T2207/10004G06T2207/30148G06T7/001G06T2207/30141G06T2207/10152H01L22/12G06F18/28G06F18/22G06T2207/30108G06T7/30
Inventor 阮羿澄陈翰星
Owner TONG HSING ELECTRONICS IND LTD