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Wafer film pasting jig

A film and wafer technology, applied in cleaning methods and utensils, removal of smoke and dust, electrical components, etc., can solve problems such as stuck, affecting the accuracy of the wafer filming operation position, and achieve good collection of dust and avoid dust reflection. Escape effect

Inactive Publication Date: 2021-06-08
梁小明
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Due to the dust on the surface in the wafer production process, when the attachment device is repeatedly lifted and lowered for film attachment, the positioning plate carrying the wafer needs to be rotated in conjunction with it, so that different wafers can be attached to the film, and the attachment head moves with the cylinder. During the lifting process driven by the power machine, the dust on the surface of the wafer will be blown towards the bayonet of the positioning plate, causing the dust to fall into it, causing the positioning plate to freeze when it is rotating, which will affect the position accuracy of the wafer film attaching operation

Method used

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  • Wafer film pasting jig
  • Wafer film pasting jig
  • Wafer film pasting jig

Examples

Experimental program
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Effect test

Embodiment 1

[0029] as attached figure 1 to attach Image 6 Shown:

[0030] The present invention provides a film sticking tool for wafers. Its structure includes a base plate 1, a base plate 2, a solid column 3, an attachment table 4, and a cylinder power machine 5. The base plate 2 is located at the top of the base plate 1, and the attachment The platform 4 moves above the base plate 2, the cylinder power machine 5 is connected to one side of the solid column 3, and the solid column 3 is embedded and installed on the bottom plate 1, and the attached platform 4 cooperates with the cylinder power machine 5.

[0031] The base plate 2 is provided with a supporting platform 21, a positioning block 22, a rotating bottom 23, and a supporting foot 24. The rotating bottom 23 is embedded and connected to the middle end of the supporting platform 21, and the positioning blocking block 22 is connected above the rotating bottom 23. And in cooperation, the support feet 24 are embedded and connected ...

Embodiment 2

[0038] as attached Figure 7 to attach Figure 8Shown:

[0039] Wherein, the collection port b3 is provided with a cavity discharge diameter b31, a side limiting plate b32, and a dust collection cavity b33. The chamber b33 is connected to the rear end of the discharge chamber diameter b31 and communicates with each other. The diameter of the discharge chamber b31 is from large to small. The dust collection chamber b33 is spherical. The transparent diameter of the discharge chamber b31 is conducive to the The driven dust enters into the dust collecting cavity b33.

[0040] Wherein, the dust collection chamber b33 is provided with a ball cavity c1, a guide door c2, and an adhesive tape c3, the ball cavity c1 and the dust collection chamber b33 are an integrated structure, the guide door c2 is hingedly connected to the ball cavity At both ends of the front side of c1, the adhesive tape c3 moves on the rear side of the ball cavity c1, the guide door c2 swings in one direction, ...

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Abstract

The invention discloses a wafer film pasting jig, which structurally comprises a bottom plate, a foundation plate, a fixing column, an attaching table and an air cylinder power machine, wherein the foundation plate is located at the top end of the bottom plate, the attaching table moves above the foundation plate, the air cylinder power machine is connected to one side of the fixing column, the fixing column is fixedly installed on the bottom plate in an embedded mode, and the attaching table is matched with the air cylinder power machine. A dust-proof device is gradually rubbed and propped to generate a clamping position due to rotation of a rotating clamping ring, such that a lateral swing frame is hinged to a solid bottom block and swings towards the side end, a pulling and connecting rod is connected with the inner side end of the lateral swing frame and provides a telescopic connecting force for the lateral swing frame, a supporting force of a supporting spring enables a top baffle to be flexibly pressed on the two sides of the top end of an opening end channel in a contact mode, thus the dustproof effect is achieved, when the lateral swing frame swings to the two sides, airflow is driven to change and has airflow force flowing towards two sides, and the dust can move towards two sides along with the airflow and then enter the collecting port.

Description

technical field [0001] The invention belongs to the field of wafer coating, and more specifically, relates to a wafer coating fixture. Background technique [0002] As an important auxiliary tool for film attachment, the film attachment tool helps to control the accuracy of the film attachment during the wafer attachment operation, and repeats the rework work, repeating the attachment of different wafers many times, replacing the traditional manual operation and improving Wafer accurate film attaching efficiency. [0003] Based on the inventor's discovery above, the existing wafer sticking fixture has the following deficiencies: [0004] Due to the dust on the surface in the wafer production process, when the attachment device is repeatedly lifted and lowered for film attachment, the positioning plate carrying the wafer needs to be rotated in conjunction with it, so that different wafers can be attached to the film, and the attachment head moves with the cylinder. During t...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/67B08B15/04
CPCB08B15/04H01L21/67132
Inventor 梁小明
Owner 梁小明