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Solid-state imaging device and imaging device

A technology of solid-state imaging devices and generating units, which is applied in the direction of electric solid-state devices, semiconductor devices, radiation control devices, etc., and can solve problems such as difficulty in meeting the needs of higher-speed processing

Pending Publication Date: 2021-06-15
SONY SEMICON SOLUTIONS CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Under such circumstances, it is difficult to meet the demand for higher-speed processing in fields related to transportation, robotics, etc.

Method used

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  • Solid-state imaging device and imaging device

Examples

Experimental program
Comparison scheme
Effect test

no. 1 example

[0079] 2.1 Configuration Example of Imaging Device

[0080] 2.2 Configuration example of solid-state imaging device

[0081] 2.2.1 Example of a stacked structure of a solid-state imaging device

[0082] 2.2.2 Examples of functional configuration of solid-state imaging devices

[0083] 2.3 Configuration example of unit pixel

[0084] 2.4 Configuration Example of Address Event Detection Unit

[0085] 2.4.1 Configuration example of current-voltage conversion unit

[0086] 2.4.2 Configuration Example of Subtractor and Quantizer

[0087] 2.5 Settings of each layer

[0088] 2.6 Examples of cross-sectional structures of solid-state imaging devices

[0089] 2.7 layer board diagram example

[0090] 2.7.1 The first chip

[0091] 2.7.2 Second chip

[0092] 2.7.2.1 Source Follower Types

[0093] 2.7.2.2 Gain boost type

[0094] 2.8 Operation and effect

no. 2 example

[0096] 3.1 Improvement of noise characteristics of transistors

[0097] 3.1.1 Using FDSOI (Fully Depleted Silicon On Insulator)

[0098] 3.1.2 Use of Tunnel FETs and Fin FETs

[0099] 3.2 Operation and effect

[0100] 4. The third embodiment

[0101] 4.1 Manufacturing process of solid-state imaging device

[0102] 4.2 Operation and effect

no. 4 example

[0104] 5.1 Configuration example of unit pixel

[0105] 5.2 Examples of cross-sectional structures of solid-state imaging devices

[0106] 5.3 Layer diagram example

[0107] 5.4 Operation and effect

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PUM

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Abstract

The purpose of the present invention is to improve noise performance. A solid-state imaging device according to an embodiment of the present invention comprises: a plurality of photoelectric conversion elements (333) that are arranged in a two-dimensional lattice in row and column directions and respectively produce charge according to amounts of light received; and a detection unit (400) that detects photoelectric current based on the charge produced in the plurality of photoelectric conversion elements. The photoelectric conversion elements and at least a part of the detection unit are disposed in different chips (201a, 201b).

Description

technical field [0001] The present disclosure relates to a solid-state imaging device and an imaging device. Background technique [0002] Conventional imaging devices and the like include a synchronous type solid-state imaging device that captures image data (frames) in synchronization with a synchronous signal (for example, a vertical synchronous signal). Such a typical synchronous type solid-state imaging device is allowed to acquire image data only once per period (for example, 1 / 60 second) of the synchronous signal. Under such circumstances, it is difficult to meet demands for higher-speed processing in fields related to transportation, robots, and the like. Therefore, there has been proposed an asynchronous type solid-state imaging device including a detection circuit provided for each pixel to detect in real time that the amount of received light exceeds a threshold value as an address event. An asynchronous type solid-state imaging device that detects an address ev...

Claims

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Application Information

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IPC IPC(8): H01L27/146H04N5/369H04N9/07
CPCH01L27/14634H01L27/1464H01L27/1463H01L27/14636H01L27/14614H01L27/1469H01L27/14641H01L27/14645H01L27/14621H01L27/14627H04N25/79H04N25/47H01L27/14609H01L27/1462H04N25/60H04N25/76H04N25/75H04N25/443H01L27/14643
Inventor 野本和生
Owner SONY SEMICON SOLUTIONS CORP
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