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Three-dimensional VC temperature uniformizing device

A three-dimensional, vapor chamber technology, which is applied in semiconductor devices, electric solid devices, semiconductor/solid device components, etc., can solve structural limitations and other problems, achieve improved heat dissipation effects, improve heat dissipation effects, and extend phase change channels Effect

Active Publication Date: 2021-06-29
SHENZHEN FRD SCI & TECH
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] At present, there are still a large number of air-cooled and water-cooled radiators in the market, which can no longer meet the needs of light structure and high heat dissipation. The more mainstream heat pipes and VC vapor chambers still need further improvement in heat dissipation due to their structural limitations. improve

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Embodiment Construction

[0023] In order to make the above objects, features and advantages of the present invention more comprehensible, the present invention will be further described in detail below in conjunction with the accompanying drawings and specific embodiments.

[0024] Such as Figure 1~6 As shown, a three-dimensional VC uniform temperature device includes: a uniform temperature plate and several harmonica flat tubes 10 arranged on the uniform temperature plate. The top of the uniform temperature plate is provided with several phase change passages 13 communicating with the uniform temperature chamber, one end of each harmonica flat tube 10 is connected to one of the phase change passages 13, and the other end is connected to another phase change passage 13. The channels 13 are connected to form a three-dimensional structure for the phase-change liquid in the uniform temperature chamber to undergo phase-change circulation.

[0025] Understandably, the harmonica flat tube 10 is a hollow s...

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Abstract

The invention relates to the technical field of electronic heat dissipation, in particular to a three-dimensional VC temperature uniformizing device. The three-dimensional VC temperature uniformizing device comprises a temperature uniformizing plate and a plurality of harmonica flat tubes arranged on the temperature uniformizing plate, wherein a temperature uniformizing cavity is formed in the temperature uniformizing plate, a plurality of phase change channels communicated with the temperature uniformizing cavity are arranged at the top part of the temperature uniformizing plate in a penetrating mode, one end of each harmonica flat tube is connected with one phase change channel, and the other end of each harmonica flat tube is connected with the other phase change channel, so that a three-dimensional structure for circulating phase change of the phase change liquid in the temperature equalizing cavity is formed. Under the guiding action of the harmonica flat tubes, heat is far away from a temperature uniformizing plate region along with a gaseous medium, so that the heat gathering amount of the temperature uniformizing plate body is reduced, the phase change channels are prolonged, the heat dissipation performance of the temperature uniformizing plate can be developed more thoroughly, and the overall heat dissipation effect is improved.

Description

technical field [0001] The invention relates to the technical field of electronic heat dissipation, in particular to a three-dimensional VC temperature equalizing device. Background technique [0002] With the rapid development of chip technology, high-integration, high-precision, high-frequency chips have come out one after another. The performance improvement brings higher calorific value. In order to ensure its normal operation for a long time, it is necessary to enforce Cool down to avoid overheating effects. [0003] At present, there are still a large number of air-cooled and water-cooled radiators in the market, which can no longer meet the needs of light structure and high heat dissipation. The more mainstream heat pipes and VC vapor chambers still need further improvement in heat dissipation due to their structural limitations. improve. Contents of the invention [0004] In view of the above problems, the present invention is proposed to provide a three-dimensio...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/467H01L23/427
CPCH01L23/467H01L23/427
Inventor 刘剑胡波覃振星
Owner SHENZHEN FRD SCI & TECH
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