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Determination Method of Back Drilling Depth of Printed Circuit Board

A technology of printed circuit board and determination method, which is applied in the direction of circuit board tool positioning, printed circuit, printed circuit manufacturing, etc., can solve the problems of high operation accuracy requirements and increased process complexity

Active Publication Date: 2022-05-13
广州广合科技股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, this method adds an additional step of making conductive holes, which increases the complexity of the process and requires high operational accuracy.

Method used

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  • Determination Method of Back Drilling Depth of Printed Circuit Board
  • Determination Method of Back Drilling Depth of Printed Circuit Board
  • Determination Method of Back Drilling Depth of Printed Circuit Board

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0054] In view of the above problems, the embodiment of the present application provides a method for determining the back-drilling depth of a printed circuit board, which can simply and quickly obtain the drilling depth data of back-drilling holes in different regions.

[0055] The technical solutions of the embodiments of the present application are described in detail below with reference to the accompanying drawings.

[0056] figure 1 It is a schematic flowchart of a method for determining the back-drilling depth of a printed circuit board shown in the embodiment of the present application.

[0057] see figure 1 , the method for determining the back drilling depth of the printed circuit board, comprising:

[0058] 101. Obtain the structural information of the printed circuit board PCB;

[0059] The structural information includes: the actual size of the PCB, the position coordinates of the back-drilled holes, and the initial drilling depth of the back-drilled holes;

...

Embodiment 2

[0093] In practical applications, this embodiment of the present application designs step 102 in the first embodiment above. figure 2 It is a schematic flow chart of the method for obtaining area information of back-drilled holes. For details, see figure 2 , the obtaining area information of the back-drilled hole based on the structural information includes:

[0094] 201. Establish a coordinate system according to the PCB;

[0095] Exemplary:

[0096] A coordinate system is established with one corner of the PCB as the origin, one long side as the x-axis, and the short side connected to the origin as the y-axis.

[0097] It should be noted that the present invention does not have strict limitations on the establishment of the coordinate system. For example, in practical applications, one corner of the PCB can be used as the origin, one short side is the x-axis, and the long side connected to the origin Establish a coordinate system for the y-axis.

[0098] It can be unde...

Embodiment 3

[0111] In practical applications, the embodiment of the present application designs the calculation method of the drilling depth compensation value in step 103 in the first embodiment above. image 3 For the flow diagram of the calculation method of drilling depth compensation value, please refer to image 3 , the calculation method of the drilling depth compensation value, comprising:

[0112] 301. Obtain the thickness difference between the first area and the second area;

[0113] In the embodiment of the present application, the thickness difference between the first region and the second region can be obtained by measuring the thickness of the first region and the thickness of the second region respectively by a PCB thickness measuring instrument.

[0114] It should be noted that, the embodiment of the present application does not strictly limit the acquisition process of the thickness difference, and the computer can acquire it based on the information imported by the us...

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Abstract

This application relates to a method for determining the back-drilling depth of a printed circuit board. The method includes: obtaining the area information of the back-drilled hole based on the actual size of the PCB and the coordinates of the back-drilled hole; calling the drilling depth compensation value and adding the initial drilling depth according to the area information of the back-drilled hole to obtain the target drilling depth of the back-drilled hole . The solution provided by this application can identify the area information of the back-drilled hole on the PCB based on the coordinates of the back-drilled hole, so as to calculate the target drilling depth according to the corresponding drilling depth compensation value of different areas, so as to meet the PCB edge area and board Different back drilling depth requirements in the middle area.

Description

technical field [0001] The present application relates to the technical field of printed circuit board manufacturing, and in particular to a method for determining the back-drilling depth of a printed circuit board. Background technique [0002] In the field of printed circuit board technology, with the expansion of switching, transmission, wireless and data communication telecommunication products and the improvement of technology, many complex systems are more dependent on the connections, wiring, and plugging on the backplane. The connector is used to handle the high-speed data flow. In order to reduce the loss and interference of the signal, the back-drilling process is usually used in the PCB design to drill out the sinking copper between the circuit layers that are not connected. With the improvement of PCB manufacturing process, the precision requirements for back drilling are getting higher and higher. Especially after the PCB is pressed, there will be a difference ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/00
CPCH05K3/0005H05K3/0008H05K3/0047
Inventor 李凯周振华雷鹏刘果余海华吴飞钟根带
Owner 广州广合科技股份有限公司